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MAL215369229E3 Datasheet(PDF) 3 Page - Vishay Siliconix |
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MAL215369229E3 Datasheet(HTML) 3 Page - Vishay Siliconix |
3 / 8 page Document Number: 28302 For technical questions, contact: aluminumcaps1@vishay.com www.vishay.com Revision: 16-May-08 3 153 CLV Aluminum Capacitors SMD (Chip) Long Life Vertical Vishay BCcomponents Table 2 MOUNTING The capacitors are designed for automatic placement on to printed-circuit boards. Optimum dimensions of soldering pads depend amongst others on soldering method, mounting accuracy, print layout and/or adjacent components. For recommended soldering pad dimensions, refer to Fig.3 and Table 3. SOLDERING Soldering conditions are defined by the curve, temperature versus time, where the temperature is that measured on the soldering pad during processing. For maximum conditions refer to Fig.4. Any temperature versus time curve which does not exceed the specified maximum curves may be applied. AS A GENERAL PRINCIPLE, TEMPERATURE AND DURATION SHALL BE THE MINIMUM NECESSARY REQUIRED TO ENSURE GOOD SOLDERING CONNECTIONS. HOWEVER, THE SPECIFIED MAXIMUM CURVES SHOULD NEVER BE EXCEEDED. Table 3 DIMENSIONS in millimeters AND MASS NOMINAL CASE SIZE L xWxH CASE CODE Lmax. Wmax. Hmax. Ø D Bmax. SC MASS (g) 4.0 x 4.0 x 5.3 0405 4.5 4.5 5.5 4.0 0.8 1.0 2.0 ± 0.2 ≈ 0.13 5.0 x 5.0 x 5.3 0505 5.5 5.5 5.5 5.0 0.8 1.4 2.3 ± 0.2 ≈ 0.20 6.3 x 6.3 x 5.3 0605 6.8 6.8 5.5 6.3 0.8 2.0 2.7 ± 0.2 ≈ 0.30 8.0 x 8.0 x 6.5 0807 8.6 8.6 6.8 8.0 0.8 2.3 3.4 ± 0.2 ≈ 0.50 8.0 x 8.0 x 10 0810 8.6 8.6 10.5 8.0 1.1 3.1 3.0 ± 0.2 ≈ 1.00 10 x 10 x 10 1010 10.6 10.6 10.5 10.0 1.1 4.7 3.3 ± 0.2 ≈ 1.30 10 x 10 x 12 1012 10.6 10.6 12.3 10.0 1.2 4.5 3.9 ± 0.2 ≈ 1.40 10 x 10 x 14 1014 10.6 10.6 14.3 10.0 1.2 4.5 3.9 ± 0.2 ≈ 1.50 0.4 ± 0.2 W B CS L C 0.3 max. Fig. 2 Dimensional outline Fig.3 Recommended solder pad dimensions RECOMMENDED SOLDERING PAD DIMENSIONS in millimeters CASE CODE a b c 0405 2.6 1.6 1.0 0505 3.0 1.6 1.4 0605 3.5 1.6 1.9 0807 4.0 1.6 2.1 0810 3.5 2.5 3.0 1010 4.0 2.5 4.0 1012 4.3 2.5 4.0 1014 4.3 2.5 4.0 280 260 240 220 200 180 160 140 120 100 80 0 50 100 150 200 250 Fig.4 Maximum temperature load during infrared reflow soldering measured on the soldering pad t (s) T PAD (°C) |
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