2

DEVICE INFORMATION

2.1 AVAILABLE OPTIONS

2.2 PIN DIAGRAMS

BAT

V

SS

SRN

SRP

V

CC

BAT_GD

SDA

SCL

1

2

3

4

5

6

12

11

10

9

8

7

BAT_LOW

TS

1

2

3

4

5

6

12

11

10

9

8

7

BI/TOUT

BAT

V

SS

V

CC

BAT_LOW

TS

BI/TOUT

NC

SRN

SRP

BAT_GD

SDA

SCL

RID

bq27500

bq27501

2.3 TERMINAL FUNCTIONS

bq27500

bq27501

System-Side Impedance Track™ Fuel Gauge

www.ti.com

SLUS785D – SEPTEMBER 2007 – REVISED APRIL 2008

TAPE and

FIRMWARE

COMMUNICATION

PART NUMBER

REEL

FORMAT

QUANTITY

bq27500DRZR

3000

V1.06

bq27500DRZT

250

bq27500DRZR-V100

3000

12-pin, 2,5-mm

× 4-mm

V1.08

–40

°C to 85°C

SON

bq27500DRZT-V100

250

bq27501DRZR

3000

V1.08

bq27501DRZT

250

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For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

TERMINAL

DESCRIPTION

bq27500

bq27501

NAME

PIN NO.

PIN NO.

BAT

4

4

I

Cell-voltage measurement input. ADC input

Battery-good indicator. Active-low by default, though polarity can be configured through

BAT_GD

12

12

O

the [BATG_POL] of Operation Configuration. Open-drain output

Battery-low output indicator. Active-high by default, though polarity can be configured

BAT_LOW

1

1

O

through the [BATL_POL] in Operation Configuration. Push-pull output

Battery-insertion detection input. Power pin for pack thermistor network. Thermistor

BI/TOUT

2

2

I/O

multiplexer control pin. Open-drain I/O. Use with pullup resistor > 1 M

Ω (1.8 MΩ typical).

NC

9

–

–

No connection (bq27500)

RID

–

9

I

Resistor ID input (bq27501). Analog input with current sourcing capabilities

SCL

11

11

I

Open-drain I/O. Use with 10-k

Ω pullup resistor (typical).

SDA

10

10

I/O

Open-drain I/O. Use with 10-k

Ω pullup resistor (typical).

Analog input pin connected to the internal coulomb counter where SRN is nearest the

SRN

8

8

IA

Analog input pin connected to the internal coulomb counter, where SRP is nearest the

SRP

7

7

IA

PACK– connection. Connect to 5-m

Ω to 20-mΩ sense resistor.

TS

3

3

IA

Pack thermistor voltage sense (use 103AT-type thermistor). ADC input

5

5

P

Processor power input. Decouple with 0.1-

µF capacitor, minimum.

Device ground. Electrically connected to the IC exposed thermal pad (do not use thermal

6

6

P

pad as primary ground. Connect thermal pad to Vss via a PCB trace).

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I = Digital input, O = Digital output, I/O = Digital input/output, IA = Analog input, P = Power connection

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DEVICE INFORMATION

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