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M24128-BWDW3G Datasheet(PDF) 31 Page - STMicroelectronics |
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M24128-BWDW3G Datasheet(HTML) 31 Page - STMicroelectronics |
31 / 39 page M24128, M24C64, M24C32 Package mechanical data 31/39 Figure 16. TSSOP8 – 8 lead thin shrink small outline, package outline 1. Drawing is not to scale. Table 21. TSSOP8 – 8 lead thin shrink small outline, package mechanical data Symbol millimeters inches(1) 1. Values in inches are converted from mm and rounded to 4 decimal digits. Typ. Min. Max. Typ. Min. Max. A 1.200 0.0472 A1 0.050 0.150 0.0020 0.0059 A2 1.000 0.800 1.050 0.0394 0.0315 0.0413 b 0.190 0.300 0.0075 0.0118 c 0.090 0.200 0.0035 0.0079 CP 0.100 0.0039 D 3.000 2.900 3.100 0.1181 0.1142 0.1220 e 0.650 – – 0.0256 – – E 6.400 6.200 6.600 0.2520 0.2441 0.2598 E1 4.400 4.300 4.500 0.1732 0.1693 0.1772 L 0.600 0.450 0.750 0.0236 0.0177 0.0295 L1 1.000 0.0394 α 0° 8° 0° 8° TSSOP8AM 1 8 CP c L E E1 D A2 A α e b 4 5 A1 L1 |
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