© 2002 Fairchild Semiconductor Corporation

www.fairchildsemi.com

FSAV330 • Rev. 1.0.3

7

Physical Dimensions

SIDE VIEW

TOP VIEW

DETAIL A

END VIEW

LAND PATTERN

RECOMMENDATION

Figure 6. 16-Lead, Quarter Size Outline Package (QSOP), JEDEC MO-137, 0.150-inch Wide

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