© 2005 Fairchild Semiconductor Corporation

www.fairchildsemi.com

FSA2467 Rev. 1.0.5

11

Package Dimensions

A. THIS PACKAGE IS NOT CURRENTLY REGISTERED WITH

C. DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994

TOP VIEW

BOTTOM VIEW

RECOMMENDED LAND PATTERN

0.10 C

0.08 C

B

A

C

2.60

1.80

0.10 C

2X

2X

SIDE VIEW

SEATING

PLANE

0.10 C

0.050

0.10 C A B

0.05 C

0.55 MAX.

0.40

PIN #1 IDENT

1

5

9

13

16

ALL TERMINALS

2.100

2.900

0.400

0.663

0.563

0.225

1

15X

16X

0.152

F. DRAWING FILE NAME : UMLP16AREV3

D. TERMINAL SHAPE MAY VARY ACCORDING TO PACKAGE

SUPPLIER, SEE TERMINAL SHAPE VARIANTS

B. DIMENSIONS ARE IN MILLIMETERS.

ANY STANDARDS COMMITTEE

0.40

0.60

0.100

0.30

0.50

0.100

TERMINAL SHAPE VARIANTS

0.15

0.25

15X

PIN 1

NON-PIN 1

0.15

0.25

15X

0.30

0.50

0.15

0.25

0.30

0.50

0.15

0.25

15X

15X

Supplier 1

Supplier 2

PIN 1

NON-PIN 1

E. LAND PATTERN IS A MINIMAL TOE DESIGN

Figure 15.

16-Lead, Ultrathin Molded Leadless Package (UMLP)

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