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STPC4HEBI Datasheet(PDF) 62 Page - STMicroelectronics

Part No. STPC4HEBI
Description  X86 Core PC Compatible Information Appliance System-on-Chip
Download  93 Pages
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Maker  STMICROELECTRONICS [STMicroelectronics]
Homepage  http://www.st.com
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STPC4HEBI Datasheet(HTML) 62 Page - STMicroelectronics

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MECHANICAL DATA
62/93
Release 1.5 - January 29, 2002
5.3. SOLDERING RECOMMENDATIONS
High
quality,
low
defect
soldering
requires
identifying the optimum temperature profile for
reflowing the solder paste, therefore optimizing
the process. The heating and cooling rise rates
must be compatible with the solder paste and
components. A typical profile consists of a
preheat, dryout, reflow and cooling sections.
The most critical parameter in the preheat
section is to minimize the rate of temperature rise
to less than
2°C / second, in order to minimize
thermal
shock
on
the
semi-conductor
components.
Dryout section is used primarily to ensure that
the solder paste is fully dried before hitting reflow
temperatures.
Solder reflow is accomplished in the reflow zone,
where
the
solder
paste
is
elevated
to
a
temperature greater than the melting point of the
solder. Melting temperature must be exceeded by
approximately 20
°C to ensure quality reflow.
In reality the profile is not a line, but rather a range
of temperatures
all solder joints must be
exposed. The total temperature deviation from
component thermal mismatch, oven loading and
oven uniformity must be within the band.
Figure 5-7. Reflow soldering temperature range
Temperature (
°C )
Time ( s )
PREHEAT
DRYOUT
REFLOW
COOLING
240
0
250
200
150
100
50
0


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