 |
Electronic Components Datasheet Search |
|
|
Electronic Components Datasheet Search |
|
STPCI2GDY Datasheet(PDF) 72 Page - STMicroelectronics |
|
||||||||||||||||||||||||||||||
STPCI2GDY Datasheet(HTML) 72 Page - STMicroelectronics |
|
|
72 / 111 page 
MECHANICAL DATA 72/111 Issue 1.0 - July 24, 2002 5.2. 516-PIN PACKAGE THERMAL DATA 516-pin PBGA package has a Power Dissipation Capability of 4.5W which increases to 6W when used with a Heatsink. The structure in shown in Figure 5-4. Thermal dissipation options are illustrated in Figure 5-5 and Figure 5-6. Figure 5-4. 516-Pin PBGA Structure Thermal balls Power & Ground layers Signal layers Figure 5-5. Thermal Dissipation Without Heatsink Ambient Case Junction Board Ambient Ambient Case Junction Board Rca Rjc Rjb Rba 66 125 8.5 Rja = 13 °C/W Airflow = 0 Board dimensions: The PBGA is centred on board Copper thickness: - 17µm for internal layers - 34µm for external layers - 10.2 cm x 12.7 cm - 4 layers (2 for signals, 1 GND, 1VCC) There are no other devices 1 via pad per ground ball (8-mil wire) 40% copper on signal layers Board temperature taken at the centre balls Board |
English ▼
Chinese
German
Japanese
Russian
Korean
Spanish
French
Italian
Portuguese
Polish
Vietnamese
