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FPF2106 Datasheet(PDF) 10 Page - Fairchild Semiconductor |
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FPF2106 Datasheet(HTML) 10 Page - Fairchild Semiconductor |
10 / 12 page 10 www.fairchildsemi.com FPF2100-FPF2107 Rev. H Application Information Typical Application OFF ON ON VIN GND FPF2100 - FPF2107 FLAGB VOUT LOAD Battery 1.8V-5.5V C1 = 4.7µF R1 = 100KΩ C2 = 0.1µF R2 = 499Ω Input Capacitor To limit the voltage drop on the input supply caused by transient in-rush currents when the switch turns-on into a discharged load capacitor or a short-circuit, a capacitor needs to be placed between VIN and GND. A 4.7µF ceramic capacitor, CIN, must be placed close to the VIN pin. A higher value of CIN can be used to further reduce the voltage drop experienced as the switch is turned on into a large capacitive load. Output Capacitor A 0.1uF capacitor COUT, should be placed between VOUT and GND. This capacitor will prevent parasitic board inductances from forcing VOUT below GND when the switch turns-off. For the FPF2100-FPF2102 and the FPF2104-FPF2106, the total output capacitance needs to be kept below a maximum value, COUT(max), to prevent the part from registering an over-current condition and turning off the switch. The maximum output capacitance can be determined from the following formula, Due to the integral body diode in the PMOS switch, a CIN greater than COUT is highly recommended. A COUT greater than CIN can cause VOUT to exceed VIN when the system supply is removed. This could result in current flow through the body diode from VOUT to VIN. Power Dissipation During normal operation as a switch, the power dissipation is small and has little effect on the operating temperature of the part. The parts with the higher current limits will dissipate the most power and that will only typically be, If the part goes into current limit the maximum power dissipation will occur when the output is shorted to ground. For the FPF2100, FPF2101, FPF2104 and FPF2105, the power dissipation will scale by the Auto-Restart Time, tRSTRT, and the Over Current Blanking Time, tBLANK, so that the maximum power dissipated is typically, When using the FPF2102 and FPF2106 attention must be given to the manual resetting of the part. Continuously resetting the part at a high duty cycle when a short on the output is present can cause the temperature of the part to increase. The junction temperature will only be allowed to increase to the thermal shutdown threshold. Once this temperature has been reached, toggling ON will not turn on the switch until the junction temperature drops. For the FPF2103 and FPF2107, a short on the output will cause the part to operate in a constant current state dissipating a worst case power as calculated in (3) until the thermal shutdown activates. It will then cycle in and out of thermal shutdown so long as the ON pin is active and the short is present. Board Layout For best performance, all traces should be as short as possible. To be most effective, the input and output capacitors should be placed close to the device to minimize the effects that parasitic trace inductances may have on normal and short-circuit operation. Using wide traces for VIN, VOUT and GND will help minimize parasitic electrical effects along with minimizing the case to ambient thermal impedance. Pmax () tBLANK tRESTART tBLANK + ---------------------------------------------------xVIN max ()xILIM max () = 10 10 160 + ----------------------- = 5.5 × 0.8 × 260mW = (3) (1) (2) C OUT max () ILIM max () t BLANK min () × VIN -------------------------------------------------------------------- = PILIM () 2 RDS × 0.2 () 2 0.125 × 80mW == = |
Similar Part No. - FPF2106 |
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Similar Description - FPF2106 |
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