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FMS6141S5X Datasheet(PDF) 8 Page - Fairchild Semiconductor |
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FMS6141S5X Datasheet(HTML) 8 Page - Fairchild Semiconductor |
8 / 11 page © 2006 Fairchild Semiconductor Corporation www.fairchildsemi.com FMS6141 Rev. 1.0.1 8 Layout Considerations General layout and supply bypassing play a major role in high-frequency performance and thermal characteristics. Fairchild offers a demonstration board for the FMS6141 to guide layout and aid device evaluation. The demo board is a four-layer board with full power and ground planes. Following this layout configuration provides optimum performance and thermal characteristics for the device. For the best results, follow the steps and recommended routing rules listed below. Recommended Routing/Layout Rules Do not run analog and digital signals in parallel. Use separate analog and digital power planes to supply power. Traces should run on top of the ground plane at all times. No trace should run over ground/power splits. Avoid routing at 90-degree angles. Minimize clock and video data trace length differences. Include 10µF and 0.1µF ceramic power supply bypass capacitors. Place the 0.1µF capacitor within 0.1 inches of the device power pin. Place the 10µF capacitor within 0.75 inches of the device power pin. For multilayer boards, use a large ground plane to help dissipate heat. For two-layer boards, use a ground plane that extends beyond the device body by at least 0.5 inches on all sides. Include a metal paddle under the device on the top layer. Minimize all trace lengths to reduce series inductance. Thermal Considerations Since the interior of most systems, such as set-top boxes, TVs, and DVD players are at +70ºC; consideration must be given to providing an adequate heat sink for the device package for maximum heat dissipation. When designing a system board, determine how much power each device dissipates. Ensure that devices of high power are not placed in the same location, such as directly above (top plane) and below (bottom plane) each other on the PCB. PCB Thermal Layout Considerations Understand the system power requirements and environmental conditions. Maximize thermal performance of the PCB. Consider using 70µm of copper for high-power designs. Make the PCB as thin as possible by reducing FR4 thickness. Use vias in power pad to tie adjacent layers together. Remember that baseline temperature is a function of board area, not copper thickness. Modeling techniques can provide a first-order approximation. Power Dissipation Consider the FMS6141’s output drive configuration when calculating overall power dissipation. Care must be taken not to exceed the maximum die junction temperature. The following example can be used to calculate the FMS6141’s power dissipation and internal temperature rise. TJ = TA + PCHANNEL ΘJA where PCHANNEL = VCC • ICH + (VO 2/R L) VO = 2VIN + 0.280V ICH = ICC + (VO/RL) VIN = RMS value of input signal ICC = 7mA VS = 5V RL = channel load resistance The FMS6141 is specified to operate with output currents typically less than 50mA, which is more than sufficient for a dual (75Ω) video load. The internal amplifiers of the FMS6141 are current limited to a maximum of 100mA and can withstand a brief-duration short-circuit condition, but this capability is not guaranteed. |
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