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ORSPI4-1FE1036C2 Datasheet(PDF) 1 Page - Lattice Semiconductor |
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ORSPI4-1FE1036C2 Datasheet(HTML) 1 Page - Lattice Semiconductor |
1 / 263 page ORCA ® ORSPI4 Dual SPI4 Interface and High-Speed SERDES FPSC October 2007 Data Sheet © 2007 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. www.latticesemi.com 1 ORSPI4_06 Embedded SPI4 Core Features ■ OIF-SPI4-02.0 compliant interfaces ■ Dynamic timing receive interface: • Full bandwidth up to 450 MHz DDR (900 Mbits/s) for all speed grades. • Bit de-skewing up to 16 phases of the clock • Capable of aligning bit-to-bit skews as large as ±1 bit periods ■ Static timing receive interface: • Speeds up to 325 MHz DDR (650 Mbits/s), for all speed grades, including Quarter-Rate mode • Clock aligned or clock centered modes sup- ported ■ DIP-4 and DIP-2 parity generation and checking ■ Transmit Interface: • Speeds up to 450 MHz DDR (900 Mbits/s) • Dedicated LVDS transmit interface for improved data eye integrity • Automatic idle insertion ■ 256 logical ports: • Embedded Calendar-based sequence port poll- ing mechanism and bandwidth allocation. Shadow Calendar support for smooth transition to new Calendar • Up to 32 independent TX and 32 independent RX buffers per SPI4 interface internally. Various aggregation modes to support 1 to 32 separate embedded buffers per TX and RX • Up to 4 independent TX and 4 independent RX clock domain transfers to the FPGA logic ■ FIFO status support modes: • 1/4 rate LVTTL or 1/4 rate LVDS • Automatic status handling or optionally under user control. Credit calculations based on burst size and status are also handled automatically ■ Configuration options as suggested in the OIF- SPI4-02.0 standard • Configures parameters such as maximum burst size, calendar length, main and shadow calen- dars (1K deep each), length of training sequence etc. ■ Simple FIFO interface to the FPGA logic • Provides ease of design and efficient clock domain transfers ■ Loopback modes provided for system- and chip-level debug ■ Embedded 32-bit internal system bus plus 4-bit parity • Interconnects FPGA logic, microprocessor inter- face (MPI), embedded RAM blocks, and embed- ded core blocks • Includes built-in system registers that act as the control and status center for the device ■ Low power operation. • Full-rate SPI4.2 interfaces running at 450 MHz DDR (900 Mbits/sec) with dynamic alignment consumes 1.5 W of power or less. More efficient than FPGAs with soft-IP SPI4 solutions which consume in excess of 10 W. ■ Programmable Minburst capability with selectable burst values ranging from 16 to 240. ■ Interoperability demonstrated with ORSPI4 partners. Embedded SERDES Core Features ■ Quad 600 Mbits/s to 3.7 Gbits/s SERDES: • IEEE 802.3ae XAUI (Link State Machine & Alignment FIFOs embedded) • ANSI X3.230:1994 1G/2G FC-compliant (Link State Machine & Alignment FIFOs embedded) • Proven performance (same SERDES used in ORT82G5/ORT42G5 FPSCs) Embedded Memory Controller Features ■ High Performance Memory Controller for interface to external buffer memory • Required for Layer 2 data buffering • QDR II memory interface: – 36-bit Input and 36-bit Output bus, 18-bit address – 175 MHz clock rates – 20+ Gbits/s bandwidth – Supports 2- or 4-word burst mode – Simple FIFO interface to FPGA – Integrated PLL for optimized performance – Proven performance with multiple memory suppliers Note: The term SPI4 refers to OIF SPI-4.2 throughout this document Lattice Semiconductor has developed a next-generation FPSC targeted at high-speed data transmission. Built on the Series 4 reconfigurable embedded System-on-a-Chip (SoC) architecture, the ORSPI4 FPSC contains two SPI4.2 interface blocks, a high-speed Memory Controller, four channels of 0.6-3.7 Gbits/s SERDES with 8b/10b encoding and decoding and over 600K programmable system gates all on a single chip. |
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