Electronic Components Datasheet Search |
|
PM6681A Datasheet(PDF) 44 Page - STMicroelectronics |
|
PM6681A Datasheet(HTML) 44 Page - STMicroelectronics |
44 / 47 page Package mechanical data PM6681A 44/47 11 Package mechanical data In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second Level Interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Table 18. VFQFPN32 5 x 5 x 1.0 mm pitch 0.50 Dim. Databook (mm) Min Typ Max A0.8 0.9 1 A1 0 0.02 0.05 A3 0.2 b 0.18 0.25 0.3 D4.85 5 5.15 D2 See exposed pad variations (2) E4.85 5 5.15 E2 See exposed pad variations (2) e0.5 L 0.3 0.4 0.5 ddd 0.05 Table 19. Exposed pad variations (1)(2)D2 1. VFQFPN stands for thermally enhanced very thin fine pitch quad flat package no lead. Very thin: A = 1.00 mm Max. 2. Dimensions D2 and E2 are not in accordance with JEDEC. E2 Min Typ Max Min Typ Max 2.90 3.10 3.20 2.90 3.10 3.20 |
Similar Part No. - PM6681A_08 |
|
Similar Description - PM6681A_08 |
|
|
Link URL |
Privacy Policy |
ALLDATASHEET.COM |
Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Datasheet Upload | Contact us | Privacy Policy | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |