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L6374 Datasheet(PDF) 6 Page - STMicroelectronics |
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L6374 Datasheet(HTML) 6 Page - STMicroelectronics |
6 / 19 page Thermal characteristics L6374 6/19 4 Thermal characteristics 4.1 RthJP The reference point is the knee on the four central pins, where the pins are upwardly bent and the soldering joint with the PCB footprint can be made. 4.2 RthJA1 If a dissipating surface, thick at least 35 µm, and with a surface similar or bigger than the one shown, is created making use of the printed circuit. Such heatsinking surface is considered on the bottom side of an horizontal PCB (worst case). 4.3 RthJA2 If the power dissipating pins (the four central ones), as well as the others, have a minimum thermal connection with the external world (very thin strips only) so that the dissipation takes place through still air and through the PCB itself. It is the same situation of point above, without any heatsinking surface created on purpose on the board. Table 4. Thermal data Symbol Parameter Value Unit RthJP Thermal resistance, junction to pin 17 °C/W RthJA1 Thermal resistance, junction to ambient (see thermal characteristics) 65 °C/W RthJA2 Thermal resistance, junction to ambient (see thermal characteristics) 80 °C/W |
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