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L6210 Datasheet(PDF) 5 Page - STMicroelectronics |
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L6210 Datasheet(HTML) 5 Page - STMicroelectronics |
5 / 8 page L6210 Mounting instructions 5/8 3 Mounting instructions The Rth j-amb of the L6210 can be reduced by soldering the GND pins to suitable copper area of the printed circuit boards as shown in Figure 3 or to an external heatsink (Figure 4). During soldering the pin temperature must not exceed 260°C and the soldering time must not be longer then 12 s. The external heatsink or printed circuit copper area must be connected to electrical ground. Figure 3. Example of PC board copper area which is used as heatsink Figure 4. Example of an external heatsink |
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