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SSM2604CPZ-R2 Datasheet(PDF) 7 Page - Analog Devices |
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SSM2604CPZ-R2 Datasheet(HTML) 7 Page - Analog Devices |
7 / 28 page SSM2604 Rev. 0 | Page 7 of 28 ABSOLUTE MAXIMUM RATINGS At 25°C, unless otherwise noted. THERMAL RESISTANCE Table 7. Parameter Rating Supply Voltage 3.6 V Input Voltage VDD Common-Mode Input Voltage VDD Storage Temperature Range −65°C to +150°C Operating Temperature Range −40°C to +85°C Junction Temperature Range −65°C to +165°C Lead Temperature (Soldering, 60 sec) 300°C θJA is specified for the worst-case conditions, that is, a device soldered in a circuit board for surface-mount packages. Table 8. Thermal Resistance Package Type θJA θJC Unit 20-Lead, 4 mm × 4 mm LFCSP 28 32 °C/W ESD CAUTION Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. |
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