REGULATORY INFORMATION

IEC SAFETY LIMITING VALUES

THERMAL CHARACTERISTICS

ISO3080, ISO3086

ISO3082, ISO3088

VDE

UL

Certified according to IEC 60747-5-2

File Number: 40016131

File Number: E181974

(1)

Production tested

≥3000 VRMS for 1 second in accordance with UL 1577.

Safety limiting intends to prevent potential damage to the isolation barrier upon failure of input or output circuitry.

A failure of the IO can allow low resistance to ground or the supply and, without current limiting, dissipate

sufficient power to overheat the die and damage the isolation barrier potentially leading to secondary system

failures.

PARAMETER

MIN

TYP

MAX

UNIT

Safety input, output, or supply

θ

DW-16

210

mA

current

Maximum case temperature

DW-16

150

°C

The safety-limiting constraint is the absolute maximum junction temperature specified in the absolute maximum

ratings table. The power dissipation and junction-to-air thermal impedance of the device installed in the

application hardware determines the junction temperature. The assumed junction-to-air thermal resistance in the

Thermal Characteristics table is that of a device installed in the JESD51-3, Low Effective Thermal Conductivity

Test Board for Leaded Surface Mount Packages and is conservative. The power is the recommended maximum

input voltage times the current. The junction temperature is then the ambient temperature plus the power times

the junction-to-air thermal resistance.

over recommended operating conditions (unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

168

θ

JA

Junction-to-Air

°C/W

High-K Thermal Resistance

96.1

θ

JB

Junction-to-Board Thermal Resistance

61

°C/W

θ

JC

Junction-to-Case Thermal Resistance

48

°C/W

Device Power Dissipation

220

mW

Input a 20 MHz 50% duty cycle square wave

(1)

Tested in accordance with the Low-K or High-K thermal metric defintions of EIA/JESD51-3 for leaded surface mount packages.

10

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Product Folder Link(s): ISO3080, ISO3086 ISO3082, ISO3088