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TLC5944 Datasheet(PDF) 3 Page - Texas Instruments

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Part No. TLC5944
Description  16-Channel, 12-Bit PWM LED Driver with 6-Bit Dot Correction and Pre-Charge FET
Download  36 Pages
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Maker  TI [Texas Instruments]
Homepage  http://www.ti.com
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TLC5944 Datasheet(HTML) 3 Page - Texas Instruments

 
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RECOMMENDED OPERATING CONDITIONS
DISSIPATION RATINGS
TLC5944
www.ti.com ...................................................................................................................................................................................................... SBVS112 – JUNE 2008
At TA= –40°C to +85°C, unless otherwise noted.
TLC5944
PARAMETER
TEST CONDITIONS
MIN
NOM
MAX
UNIT
DC Characteristics: VCC = 3 V to 5.5 V
VCC
Supply voltage
3.0
5.5
V
VUP
Pre-charge voltage
3.0
15
V
VO
Voltage applied to output
OUT0 to OUT15
VUP
V
VIH
High-level input voltage
0.7 × VCC
VCC
V
VIL
Low-level input voltage
GND
0.3 × VCC
V
IOH
High-level output current
SOUT
–1
mA
SOUT
1
mA
IOL
Low-level output current
XERR
5
mA
IOLC
Constant output sink current
OUT0 to OUT15
60
mA
TA
Operating free-air temperature
–40
+85
°C
Operating junction
TJ
–40
+125
°C
temperature
AC Characteristics: VCC = 3 V to 5.5 V
fCLK (sclk)
Data shift clock frequency
SCLK
30
MHz
Grayscale control clock
fCLK (gsclk)
GSCLK
33
MHz
frequency
TWH0/TWL0
SCLK, GSCLK
10
ns
Pulse duration
TWH1
XLAT, BLANK
15
ns
TSU0
SIN–SCLK
5
ns
TSU1
BLANK
↓–GSCLK↑
15
ns
TSU2
XLAT
↑–SCLK↑
100
ns
Setup time
XLAT
↓–SCLK↑
TSU3
20
ns
(for SID reading only)
TSU4
DCSEL–SCLK
10
ns
TSU5
DCSEL–XLAT
10
ns
TH0
SIN–SCLK
3
ns
TH1
XLAT
↑–SCLK↑
10
ns
Hold time
TH2
DCSEL–SCLK
10
ns
TH3
DCSEL–XLAT
100
ns
OPERATING FACTOR
TA < +25°C
TA = +70°C
TA = +85°C
PACKAGE
ABOVE TA = +25°C
POWER RATING
POWER RATING
POWER RATING
HTSSOP-28 with
31.67 mW/°C
3958 mW
2533 mW
2058 mW
PowerPAD soldered(1)
HTSSOP-28 with
16.21 mW/°C
2026 mW
1296 mW
1053 mW
PowerPAD not soldered(2)
QFN-32(3)
27.86 mW/°C
3482 mW
2228 mW
1811 mW
(1)
With PowerPAD soldered onto copper area on printed circuit board (PCB); 2-oz. copper. For more information, see SLMA002 (available
for download at www.ti.com).
(2)
With PowerPAD not soldered onto copper area on PCB.
(3)
The package thermal impedance is calculated in accordance with JESD51-5.
Copyright © 2008, Texas Instruments Incorporated
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