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UCC28230_0806 Datasheet(PDF) 4 Page - Texas Instruments

Part No. UCC28230_0806
Description  Advanced PWM Controller for Bus Converters
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Maker  TI [Texas Instruments]
Homepage  http://www.ti.com
Logo TI - Texas Instruments

UCC28230_0806 Datasheet(HTML) 4 Page - Texas Instruments

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ABSOLUTE MAXIMUM RATINGS
DISSIPATION RATINGS
(1)
RECOMMENDED OPERATING CONDITIONS
UCC28230
UCC28231
SLUS814A – FEBRUARY 2008 – REVISED JUNE 2008 ................................................................................................................................................... www.ti.com
over operating free-air temperature range
(1) (2)(unless otherwise noted)
PARAMETER
VALUE
UNIT
VDD
(3)
Input supply voltage range
–0.3 to 20.0
O1_D, O2_D, O1_DIN, O2_DIN
–0.3 to VDD +0.3
Inputs voltages on OS, CS, SS, RT, OST
–0.3 to 6.3
V
Output voltage on VREF
–0.3 to 5.6
HBM
2k
ESD rating
CDM
500
Continuous total power dissipation
See Dissipation Rating Table
TJ
Operating virtual junction temperature range
–55 to +150
TA
Operating ambient temperature range
–55 to +125
°C
Tstg
Storage Temperature
–65 to +150
Lead Temperature (Soldering, 10 sec.) PW Package
+300
(1)
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
These devices are sensitive to electrostatic discharge; follow proper device handling procedures.
(3)
All voltages are with respect to GND unless otherwise noted. Currents are positive into, negative out of the specified terminal. See
Packaging Section of the datasheet for thermal limitations and considerations of packages.
θ
JC (°C/W)
θ
JA (°C/W)
θ
JB (°C/W)
θ
JP (°C/W)
BOARD
PACKAGE
JUNCTION TO
JUNCTION TO
JUNCTION TO
JUNCTION TO PAD
CASE
AMBIENT
BOARD
High-K(2)
DRN
70.66
15
37.66
PW
2.71
97.65
2.07
(1)
These thermal data are taken at standard JEDEC test conditions and are useful for the thermal performance comparison of different
packages. The cooling condition and thermal impedance RθJA of practical design is specific.
(2)
The JEDEC test board JESD51-5 with direct thermal pad attach, 3-inch × 3-inch, 4-layer with 1-oz internal power and ground planes and
2-oz top and bottom trace layers (preliminary data based on modeling)
MIN
NOM
MAX
UNIT
VDD
Supply voltage range
7
12
17
V
Operating junction temperature range
–55
125
°C
4
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Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s): UCC28230 UCC28231


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