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NSSL100DT Datasheet(PDF) 6 Page - NICHIA CORPORATION

Part No. NSSL100DT
Description  SPECIFICATIONS FOR NICHIA CHIP TYPE WARM WHITE LED
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Maker  NICHIA [NICHIA CORPORATION]
Homepage  http://www.nichia.co.jp
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NSSL100DT Datasheet(HTML) 6 Page - NICHIA CORPORATION

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-5-
120sec.Max.
Pre-heating
260°C Max.
10sec. Max.
60sec.Max.
Above 220°C
1 ~ 5°C / sec.
1 ~ 5°C / sec.
180 ~ 200°C
<
1 : Lead Solder>
<
2 : Lead-free Solder>
Pre-heating
240°C Max.
10sec. Max.
60sec.Max.
Above 200
°C
2.5 ~ 5°C / sec.
2.5 ~ 5°C / sec.
120 ~ 150°C
120sec.Max.
Nichia
STSE-CC7174A
<Cat.No.070718>
(4) Soldering Conditions
· The LEDs can be soldered in place using the reflow soldering method.
Nichia cannot make a
guarantee on the LEDs after they have been assembled using the dip soldering method.
· Recommended soldering conditions
Reflow Soldering
Hand Soldering
Lead Solder
Lead-free Solder
Pre-heat
Pre-heat time
Peak
temperature
Soldering time
Condition
120
~ 150°C
120 sec. Max.
240°C Max.
10 sec. Max.
refer to
Temperature - profile
1.
180
~ 200°C
120 sec. Max.
260°C Max.
10 sec. Max.
refer to
Temperature - profile
2.
(N2 reflow is recommended.)
Temperature
Soldering time
350°C Max.
3 sec. Max.
(one time only)
Although the recommended soldering conditions are specified in the above table, reflow or hand
soldering at the lowest possible temperature is desirable for the LEDs.
A rapid-rate process is not recommended for cooling the LEDs down from the peak temperature.
[Temperature-profile (Surface of circuit board)]
Use the conditions shown to the under figure.
[Recommended soldering pad design]
Use the following conditions shown in the figure.
· Occasionally there is a brightness decrease caused by the influence of heat or ambient atmosphere
during air reflow.
It is recommended that the User use the nitrogen reflow method.
· The encapsulated material of the LEDs is silicone. Therefore the LEDs have a soft surface on the
top of package.
The pressure to the top surface will be influence to the reliability of the LEDs.
Precautions should be taken to avoid the strong pressure on the encapsulated part.
So when using
the chip mounter, the picking up nozzle that does not affect the silicone resin should be used.
· Repairing should not be done after the LEDs have been soldered.
When repairing is unavoidable,
a double-head soldering iron should be used.
It should be confirmed beforehand whether the
characteristics of the LEDs will or will not be damaged by repairing.
· Reflow soldering should not be done more than two times.
· When soldering, do not put stress on the LEDs during heating.
· After soldering, do not warp the circuit board.
(5) Cleaning
· It is recommended that isopropyl alcohol be used as a solvent for cleaning the LEDs.
When using
other solvents, it should be confirmed beforehand whether the solvents will dissolve the package and the
resin or not.
Freon solvents should not be used to clean the LEDs because of worldwide regulations.
· Do not clean the LEDs by the ultrasonic.
When it is absolutely necessary, the influence of ultrasonic
cleaning on the LEDs depends on factors such as ultrasonic power and the assembled condition.
Before cleaning, a pre-test should be done to confirm whether any damage to the LEDs will occur.
2.2
1.5
4.4
(Unit : mm)


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