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NJSW036AT Datasheet(PDF) 6 Page - NICHIA CORPORATION |
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NJSW036AT Datasheet(HTML) 6 Page - NICHIA CORPORATION |
6 / 14 page -5- Nichia STSE-CC7023A <Cat.No.070223> (4) Designing the position of LED on a board. · No twist / warp / bent / or other stress shall be applied to the board after mounting LED with solder to avoid a crack of LED package. Refer to the following recommended position and direction of LED. 【No good】 【Recommended Direction】 Appropriate LED mounting is to place perpendicularly against the stress affected side. · Depending on the position and direction of LED, the mechanical stress on the LED package can be changed. Refer to the following figure. Perforated line Slit Stress : A > B = C > D > E · Do not split board by hand. Split with exclusive special tool. · If an aluminum circuit board is used, a large stress by thermal shock might cause a solder crack. For this reason, it is recommended an appropriate verification should be taken before use. Cathode mark Cathode mark E A C D B |
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