-5-

Nichia

STSE-CC5041A-1

<Cat.No.061107>

(4) Soldering Conditions

· The LEDs can be soldered in place using the reflow soldering method and the dip soldering method.

· Recommended soldering conditions

Reflow Soldering

Dip Soldering

Hand Soldering

Lead Solder

Lead-free Solder

Pre-heat

Pre-heat time

Peak

temperature

Soldering time

Condition

120 ~ 150°C

120 sec. Max.

240°C Max.

10 sec. Max.

refer to

Temperature

- profile

180 ~ 200°C

120 sec. Max.

260°C Max.

10 sec. Max.

refer to

Temperature

- profile

recommended.)

Pre-heat

Pre-heat time

Solder bath

temperature

Dipping time

100°C Max.

60 sec. Max.

260°C Max.

10 sec. Max.

Temperature

Soldering time

350°C Max.

3 sec. Max.

(one time only)

Although the recommended soldering conditions are specified in the above table, reflow, dip or hand

soldering at the lowest possible temperature is desirable for the LEDs.

A rapid-rate process is not recommended for cooling the LEDs down from the peak temperature.

[Temperature-profile (Surface of circuit board)]

Use the conditions shown to the under figure.

[Recommended soldering pad design]

Use the following conditions shown in the figure.

· Occasionally there is a brightness decrease caused by the influence of heat or ambient atmosphere

during air reflow.

It is recommended that the User use the nitrogen reflow method.

· Repairing should not be done after the LEDs have been soldered.

When repairing is unavoidable,

a double-head soldering iron should be used.

It should be confirmed beforehand whether the

characteristics of the LEDs will or will not be damaged by repairing.

· Reflow soldering should not be done more than two times.

· Dip soldering should not be done more than one time.

· When soldering, do not put stress on the LEDs during heating.

· After soldering, do not warp the circuit board.

60sec.Max.

Above 220

°C

120sec.Max.

Pre-heating

260°C Max.

10sec. Max.

1~ 5°C / sec.

1~ 5°C / sec.

180 ~ 200°C

<

<

60sec.Max.

Above 200

°C

120sec.Max.

Pre-heating

240°C Max.

10sec. Max.

2.5 ~ 5°C / sec.

2.5 ~ 5°C / sec.

120 ~ 150°C

: Solder resist

4

4

9.5

1.5

1.5

(Unit : mm)