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RT9004GPQV Datasheet(PDF) 10 Page - Richtek Technology Corporation |
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RT9004GPQV Datasheet(HTML) 10 Page - Richtek Technology Corporation |
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10 / 12 page  RT9004 Preliminary 10 DS9004-00 February 2008 www.richtek.com For continuous operation, do not exceed absolute maximum operation junction temperature 125 °C. The power dissipation definition in device is : PD = (VIN-VOUT) x IOUT + VIN x IQ The maximum power dissipation depends on the thermal resistance of IC package, PCB layout, the rate of surroundings airflow and temperature difference between junction to ambient. The maximum power dissipation can be calculated by following formula : PD(MAX) = ( TJ(MAX) - TA ) / θJA Where TJ(MAX) is the maximum operation junction temperature 125 °C, TAis the ambient temperature and the θJA is the junction to ambient thermal resistance. For recommended operating conditions specification of RT9004, where TJ(MAX) is the maximum junction temperature of the die (125 °C) and TA is the maximum ambient temperature. The junction to ambient thermal resistance θJA is layout dependent. For VDFN-10L 3x3 and WDFN-10L 3x3 packages, the thermal resistance θJA is 105 °C/W on the standard JEDEC 51-3 single-layer 1s thermal test board and 70 °C/W on the standard JEDEC 51-7 4-layers 2S2P thermal test board. The maximum power dissipation at TA = 25 °C can be calculated by following formula : PD(MAX) = ( 125 °C - 25°C ) / 105 = 0.952 W for single-layer 1s board PD(MAX) = ( 125 °C - 25°C ) / 70 = 1.428 W for 4-layers 2S2P board The maximum power dissipation depends on operating ambient temperature for fixed TJ(MAX) and thermal resistance θJA. For RT9004 packages, the Figure 3 of derating curves allows the designer to see the effect of rising ambient temperature on the maximum power allowed. 0 150 300 450 600 750 900 1050 1200 1350 1500 0 25 50 75 100 125 Ambient Temperature ( °C) 4-Layers Board Single-Layer Board Figure 3. Derating Curves for RT9004 Package |
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