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Available on Tape and

Reel for Pick and Place

Manufacturing.

Model BD2425N50200A00

Rev D

Mounting Configuration:

In order for Xinger surface mount components to work optimally, the proper impedance transmission lines must be

used to connect to the RF ports. If this condition is not satisfied, insertion loss, Isolation and VSWR may not meet

published specifications.

All of the Xinger components are constructed from ceramic filled PTFE composites which possess excellent electrical

and mechanical stability having X and Y thermal coefficient of expansion (CTE) of 17 ppm/

An example of the PCB footprint used in the testing of these parts is shown below. An example of a DC-biased

footprint is also shown below. In specific designs, the transmission line widths need to be adjusted to the unique

dielectric coefficients and thicknesses as well as varying pick and place equipment tolerances

With No DC Bias

With DC Bias

Plated thru

hole to

ground

Solder Resist

Footprint Pad (s)

Circuit Pattern

3X Transmission

Line

3X .011

[0.29]

3X .011

[0.29]

.020

[0.50]

.020

[0.50]

Dimensions are in Inches [Millimeters]

Mounting Footprint

.008 [0.21]

.008 [0.21]

.014 [0.36]

Plated thru

hole to

ground

Solder Resist

Footprint Pad (s)

Circuit Pattern

3X Transmission

Line

3X .011

[0.29]

3X .011

[0.29]

.020

[0.50]

.020

[0.50]

Dimensions are in Inches [Millimeters]

Mounting Footprint

.008 [0.21]

.008 [0.21]

.014 [0.36]