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ST6215C Datasheet(PDF) 94 Page - STMicroelectronics |
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ST6215C Datasheet(HTML) 94 Page - STMicroelectronics |
94 / 105 page ![]() ST6215C/ST6225C 94/105 12.3 SOLDERING AND GLUEABILITY INFORMATION Recommended soldering information given only as design guidelines in Figure 78 and Figure 79. Recommended glue for SMD plastic packages: s Heraeus: PD945, PD955 s Loctite: 3615, 3298 Figure 78. Recommended Wave Soldering Profile (with 37% Sn and 63% Pb) Figure 79. Recommended Reflow Soldering Oven Profile (MID JEDEC) 250 200 150 100 50 0 40 80 120 160 Time [sec] Temp. [°C] 20 60 100 140 5 sec COOLING PHASE (ROOM TEMPERATURE) PREHEATING 80°C PHASE SOLDERING PHASE 250 200 150 100 50 0 100 200 300 400 Time [sec] Temp. [°C] ramp up 2°C/sec for 50sec 90 sec at 125°C 150 sec above 183°C ramp down natural 2°C/sec max Tmax=220+/-5°C for 25 sec 1 |