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TDA7850AH Datasheet(PDF) 12 Page - STMicroelectronics

Part No. TDA7850AH
Description  4 x 50 W MOSFET quad bridge power amplifier plus HSD
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Maker  STMICROELECTRONICS [STMicroelectronics]
Homepage  http://www.st.com
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TDA7850AH Datasheet(HTML) 12 Page - STMicroelectronics

 
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Application hints
TDA7850A
12/16
4
Application hints
Ref. to the circuit of Figure 2.
4.1
SVR
Besides its contribution to the ripple rejection, the SVR capacitor governs the turn ON/OFF time
sequence and, consequently, plays an essential role in the pop optimization during ON/OFF
transients. To conveniently serve both needs, Its minimum recommended value is 10µF.
4.2
Input stage
The TDA7850A's inputs are ground-compatible and can stand very high input signals
(± 8Vpk) without any performance degradation.
If the standard value for the input capacitors (0.1µF) is adopted, the low frequency cut-off
will amount to 16 Hz.
4.3
Stand-by and muting
STAND-BY and MUTING facilities are both CMOS compatible. In absence of true CMOS
ports or microprocessors, a direct connection to Vs of these two pins is admissible but a
470k
Ω equivalent resistance should be present between the power supply and the muting
and stand-by pins.
R-C cells have always to be used in order to smooth down the transitions for preventing any
audible transient noises.
About the stand-by, the time constant to be assigned in order to obtain a virtually pop-free
transition has to be slower than 2.5V/ms.
4.4
DC offset detector
The TDA7850A integrates a DC offset detector to avoid that an anomalous DC offset on the
inputs of the amplifier may be multiplied by the gain and result in a dangerous large offset on
the outputs which may lead to speakers damage for overheating.
The feature works with the amplifier unmuted and no signal at the inputs.
The DC offset detection can be available at 2 different pins:
Pin 2 (always enabled)
Pin 26. Only enabled if Vmute (pin23) is set higher than 8V. If not (Vmute < 6 V)
pin 26 will revert to the original HSD function.
4.5
Heatsink definition
Under normal usage (4 Ohm speakers) the heatsink's thermal requirements have to be
deduced from Figure 16, which reports the simulated power dissipation when real
music/speech programmes are played out. Noise with gaussian-distributed amplitude was
employed for this simulation. Based on that, frequent clipping occurrence (worst-case) will
cause Pdiss = 26W. Assuming Tamb = 70°C and TCHIP = 150°C as boundary conditions, the
heatsink's thermal resistance should be approximately 2°C/W. This would avoid any thermal
shutdown occurrence even after long-term and full-volume operation.


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