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CHX3068-QDG Datasheet(PDF) 3 Page - United Monolithic Semiconductors

Part # CHX3068-QDG
Description  15-30GHz Frequency Multiplier
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Manufacturer  UMS [United Monolithic Semiconductors]
Direct Link  http://www.ums-gaas.com
Logo UMS - United Monolithic Semiconductors

CHX3068-QDG Datasheet(HTML) 3 Page - United Monolithic Semiconductors

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15-30GHz Frequency Multiplier
CHX3068-QDG
Ref:. DSCHX3068-QDG8144 - 23 May 08
3/8
Specifications subject to change without notice
Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE
Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09
Absolute Maximum Ratings (1)
Tamb = +25°C
Symbol
Parameter
Values
Unit
Vd
Drain bias voltage
4.5
V
Id
Drain bias current
330
mA
Pin
Maximum input power
+8
dBm
Tjmax
Maximum Junction Temperature
175
°C
Ta
Operating temperature range
-40 to +85
°C
Tstg
Storage temperature range
-55 to +125
°C
(1) Operation of this device above anyone of these paramaters may cause permanent damage.
Device thermal performances:
All the figures given in this section are obtained assuming that the QFN device is cooled
down only by conduction through the package thermal pad (no convection mode
considered).
The temperature is monitored at the package back-side interface (Tcase) as shown below.
The system maximum temperature must be adjusted in order to guarantee that Tcase
remains below than the maximum value specified in the next table. So, the system PCB
must be designed to comply with this requirement.
A derating must be applied on the dissipated power if the case temperature (Tcase) can not
be maintained below the maximum temperature specified in order to guarantee the nominal
device life time (MTTF) (see the curve Pdiss. Max).
Max. junction temperature (Tj max)
:
155 °C
Max. continuous dissipated power @ Tcase=
85
°C
:
1.08 W
=> Pdiss derating above Tcase
(1)=
85
°C
:
15 mW/°C
Junction-Case thermal resistance (Rth J-C)
(2)
:
<65 °C/W
Min. package back side operating temperature
(3)
:
-40 °C
Max. package back side operating temperature
(3)
:
85 °C
Min. storage temperature
:
-55 °C
Max. storage temperature
:
125 °C
(1) Derating at junction temperature constant = Tj max.
(2) Rth J-C is calculated for a worst case where the hotter junction of the MMIC is considered.
(3) Tcase=Package back side temperature measured under the die-attach-pad (see the drawing below).
DEVICE THERMAL SPECIFICATION : CHX3068-QDG
0
0.2
0.4
0.6
0.8
1
1.2
-50
-25
0
25
50
75
100
125
Tcase (°C)
Pdiss. Max. (W)
Tcase
Example of QFN 16L 3x3
back-side view, temperature
reference point (Tcase) location.


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