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ISPLSI3192-100LB272I Datasheet(PDF) 10 Page - Lattice Semiconductor

Part # ISPLSI3192-100LB272I
Description  High Density Programmable Logic
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Manufacturer  LATTICE [Lattice Semiconductor]
Direct Link  http://www.latticesemi.com
Logo LATTICE - Lattice Semiconductor

ISPLSI3192-100LB272I Datasheet(HTML) 10 Page - Lattice Semiconductor

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Specifications ispLSI 3192
10
Power Consumption
operating and the number of product terms used. Figure
3 shows the relationship between power and operating
speed.
Power Consumption in the ispLSI 3192 device depends
on two primary factors: the speed at which the device is
240
440
640
540
340
010
20
3040
50
6070
fmax (MHz)
Notes: Configuration of 16 16-bit Counters
Typical Current at 5V, 25° C
ispLSI 3192
0127/3192
ICC can be estimated for the ispLSI 3192 using the following equation:
ICC = 50 + (# of PTs * 0.65) + (# of nets * Max. freq * 0.015) where:
# of PTs = Number of Product Terms used in design
# of nets = Number of Signals used in device
Max. freq = Highest Clock Frequency to the device
The ICC estimate is based on typical conditions (VCC = 5.0V, room temperature) and an assumption of 2 GLB loads on
average exists. These values are for estimates only. Since the value of ICC is sensitive to operating conditions and the
program in the device, the actual ICC should be verified.
80
90
100
Figure 3. Typical Device Power Consumption vs fmax
Package Thermal Characteristics
For the ispLSI 3192-100LB272, it is strongly recom-
mended that the actual Icc be verified to ensure that the
maximum junction temperature (TJ) with power supplied
is not exceeded. Depending on the specific logic design
and clock speed, airflow may be required to satisfy the
maximum allowable junction temperature (TJ) specifica-
tion. Please refer to the Thermal Management section of
the Lattice Semiconductor Data Book or CD-ROM for
additional information on calculating TJ.


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