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5962-9088201MPA Datasheet(PDF) 5 Page - Texas Instruments |
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5962-9088201MPA Datasheet(HTML) 5 Page - Texas Instruments |
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5 / 64 page  TLC220x, TLC220xA, TLC220xB, TLC220xY Advanced LinCMOS ™ LOW-NOISE PRECISION OPERATIONAL AMPLIFIERS SLOS175 – FEBRUARY 1997 5 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 TLC2201Y chip information This chip, when properly assembled, displays characteristics similar to the TLC2201C. Thermal compression or ultrasonic bonding may be used on the doped-aluminum bonding path. Chips may be mounted with conductive epoxy or a gold-silicon preform. BONDING PAD ASSIGNMENTS CHIP THICKNESS: 15 MILS TYPICAL BONDING PADS: 4 × 4 MILS MINIMUM TJmax = 150°C TOLERANCES ARE ±10%. ALL DIMENSIONS ARE IN MILS. PIN (4) IS INTERNALLY CONNECTED TO BACK SIDE OF CHIP. TERMINAL NUMBERS ARE FOR THE D, JG, AND P PACKAGES. + – OUT IN – IN + VDD+ (7) (2) (3) (6) (4) VDD – 65 77 (2) (3) (4) (6) (7) (8) (1) |
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