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TSV358AIYPT Datasheet(PDF) 9 Page - Texas Instruments |
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TSV358AIYPT Datasheet(HTML) 9 Page - Texas Instruments |
9 / 17 page TSV321-TSV358-TSV324 Package information 9/17 3 Package information In order to meet environmental requirements, STMicroelectronics offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an STMicroelectronics trademark. ECOPACK specifications are available at: www.st.com. 3.1 SOT23-5 package information Figure 19. SOT23-5 package mechanical drawing Table 5. SOT23-5 package mechanical data Ref. Dimensions Millimeters Mils Min. Typ. Max. Min. Typ. Max. A 0.90 1.45 35.4 57.1 A1 0.00 0.15 0.00 5.9 A2 0.90 1.30 35.4 51.2 b 0.35 0.50 13.7 19.7 C 0.09 0.20 3.5 7.8 D 2.80 3.00 110.2 118.1 E 2.60 3.00 102.3 118.1 E1 1.50 1.75 59.0 68.8 e 0.95 37.4 e1 1.9 74.8 L 0.35 0.55 13.7 21.6 |
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