18-30GHz Low Noise Amplifier

CHA2069-QDG

Ref. : DSCHA2069QDG6332 - 28 Nov 06

13/18

Specifications subject to change without notice

Route Départementale 128, B.P.46 - 91401 ORSAY Cedex - FRANCE

Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09

(For production, design must be adapted with regard to PCB tolerances and

assembly process)

Basic footprint for a 24L-QFN4x4 (all units mm)

(Please, refer to the UMS propose footprint for optimum

operation in the following “Proposed Assembly board” section)

The RF ports are DC blocked on chip. The DC connection (Vd) does not include any

decoupling capacitor in package, therefore it is mandatory to provide a good external DC

decoupling on the PC board, as close as possible to the package.

SMD mounting procedure

The SMD leadless package has been designed for high volume surface mount PCB

assembly process. The dimensions and footprint required for the PCB (motherboard) are

given in the drawings above.

For the mounting process standard techniques involving solder paste and a suitable reflow

process can be used. For further details, see application note AN0017.