Switch Function

SPST- 2 through 10 and 12 positions

Switch Contact Resistance

Insulation Resistance

1,000 megohms minimum between

insulated terminals

Dielectric Strength

500 VDC for 1 minute between adjacent

switches

Nonswitching Rating

100 mA or 50 VDC maximum

Switch Capacitance

5 pF maximum between adjacent closed switches

Operating Temperature

–40°C to +85°C

Actuation Life

Series 209: 2,000 cycles switching @ 100 mA,

20 VDC or @ .1 mA, 5 VDC (dry circuit)

Series 210: 1,000 cycles switching @ 100 mA,

20 VDC or @ .1 mA, 5 VDC (dry circuit)

Allowable Solder Time

Up to 5 seconds at 260°C

Vibration

Per MIL-STD-202F, method 204D, condition B

(.06" or 15 G’s between 10 HZ to 2K HZ) with no

contact inconsistencies greater than 1 microsecond.

Shock

Per MIL-STD-202F, method 213B, condition A

(50 G’s) with no contact inconsistencies greater

than 1 microsecond.

Sealing

Standard bottom seal

Optional top tape seal

Automatically

Insertable, Wave

Solderable, Board

Washable DIP Switch

Optimized Mechanical Features

• Fully sealed to withstand insertion shock,

wave solder temperatures, and board washing

• Positive detent seperated from contactor

• Compatible with Amistar, DynaPert,

Universal, NETCO assembly and other machines

Optimized Contact System

• Redundant, wiping contact

• Contactor does not deflect during actuation

Materials

• Series 209 - gold plated beryllium copper contacts

• Series 210 - gold flash plated beryllium copper contacts

• High temperature material (UL94V-0)

Electrical and Mechanical Specifications

®

Series 209 – Premium AUTO-DIP Switches

Series 210 – Economical AUTO-DIP Switches

Features

• Available low profile, medium and extended height

actuator

• RoHS compliant

1 - 2

CTS Electronic Components

www.ctscorp.com

Switch Series

Initial, max.

End of life, max.

209

25 milliohms

50 millohms

210

100 milliohms

500 millohms

Packaging

Standard : Anti-Static tube packaging

© 2008 CTS Corporation. All rights reserved. Information subject to change.

2/19/08