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UCC28230PWT Datasheet(PDF) 3 Page - Texas Instruments |
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UCC28230PWT Datasheet(HTML) 3 Page - Texas Instruments |
3 / 7 page www.ti.com ABSOLUTE MAXIMUM RATINGS (1) (2) DISSIPATION RATINGS (1) RECOMMENDED OPERATING CONDITIONS UCC28230 UCC28231 SLUS814 – FEBRUARY 2008 ORDERING INFORMATION TEMPERATURE RANGE, REFERENCE PACKAGE TAPE AND REEL QTY PART NUMBER TA = TJ VOLTAGE 5 V 250 UCC28230DRNT 5 V 3000 UCC28230DRNR Plastic 12-pin SON (DRN) 3.3 V 250 UCC28231DRNT 3.3 V 3000 UCC28231DRNR -40 °C to +125°C 5 V 250 UCC28230PWT 5 V 2000 UCC28230PWR Plastic 14-pin TSSOP (PW) 3.3 V 250 UCC28231PWT 3.3 V 2000 UCC28231PWR over operating free-air temperature range (unless otherwise noted) VALUE UNIT VDD Input supply voltage range, (3) -0.3 to 20.0 O1_D, O2_D, O1_DIN, O2_DIN -0.3 to VDD +0.3 Inputs voltages on OS, CS, SS, RT, OST -0.3 to 6.3 V Output voltage on VREF -0.3 to 5.6 HBM ESD rating, 2k CDM ESD rating 500 Continuous total power dissipation NoLabel TJ Operating virtual junction temperature range, -40 to +150 TA Operating ambient temperature range, -40 to +125 °C Tstg Storage temperature, -65 to +150 Lead temperature (Soldering, 10 sec.) +300 (1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) These devices are sensitive to electrostatic discharge; follow proper device handling procedures. (3) All voltages are with respect to GND unless otherwise noted. Currents are positive into, negative out of the specified terminal. See Packaging Section of the datasheet for thermal limitations and considerations of packages. DERATING TA <25°C TA = 70°C TA = 85°C FACTOR BOARD PACKAGE RΘJC RΘJA POWER POWER POWER ABOVE TA = RATING RATING RATING 25 °C High-K(2)(2) DRN PW 110 °C 9.07mW/ °C 907 mW (1) These thermal data are taken at standard JEDEC test conditions and are useful for the thermal performance comparison of different packages. The cooling condition and thermal impedance R θJA of practical design is specific. (2) The JEDEC test board JESD51-5 with direct thermal pad attach, 3-inch x 3-inch, 4-layer with 1-oz internal power and ground planes and 2-oz top and bottom trace layers (preliminary data based on modeling) over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT VDD Supply voltage range 7 12 17 V TJ Operating junction temperature range -40 125 °C Copyright © 2008, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Link(s): UCC28230 UCC28231 |
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