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LM2675 Datasheet(PDF) 23 Page - National Semiconductor (TI) |
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LM2675 Datasheet(HTML) 23 Page - National Semiconductor (TI) |
23 / 26 page Application Information (Continued) When using the adjustable version, special care must be taken as to the location of the feedback resistors and the associated wiring. Physically locate both resistors near the IC, and route the wiring away from the inductor, especially an open core type of inductor. LLP PACKAGE DEVICES The LM2675 is offered in the 16 lead LLP surface mount package to allow for increased power dissipation compared to the SO-8 and DIP. The Die Attach Pad (DAP) can and should be connected to PCB Ground plane/island. For CAD and assembly guide- lines refer to Application Note AN-1187 at http:// power.national.com. www.national.com 23 |
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