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Pin Descriptions

Vin:

The positive input voltage power node to the mod-

ule, which is referenced to common GND.

Vout:

The regulated positive power output with respect

to the GND node.

GND:

This is the common ground connection for the

Inhibit:

The Inhibit pin is an open-collector/drain negative

logic input that is referenced to GND. Applying a low-

level ground signal to this input disables the module’s

output and turns off the output voltage. When the Inhibit

control is active, the input current drawn by the regulator

is significantly reduced. If the Inhibit pin is left open-

circuit, the module will produce an output whenever a

valid input source is applied.

Vo Adjust:

A 1-% resistor must be connected between this

pin and GND (pin 1) to set the output voltage of the

module higher than its lowest value. The temperature

stability of the resistor should be 100 ppm/°C (or better).

The set-point range is 1.2 V to 5.5 V for W-suffix devices,

and 0.8 V to 1.8 V for L-suffix devices. The resistor value

required for a given output voltage may be calculated

using a formula. If left open circuit, the output voltage

will default to its lowest value. For further information

on output voltage adjustment consult the related applica-

tion note.

The specification tables also give the preferred resistor

values for a number of standard output voltages.

Ordering Information

Code

Description

AH

Horiz. T/H

(EUS)

AS

(EUT)

Code

Voltage

W

1.2 V – 5.5 V

(Adjust)

L

0.8 V – 1.8 V

(Adjust)

Notes:

(1) Add “T” to end of part number for tape and reel on SMD packages only.

(2) Reference the applicable package reference drawing for the dimensions and PC board layout

(3) “Standard” option specifies 63/37, Sn/Pb pin solder material.

6-A, 12-V Input Non-Isolated

Wide-Output Adjust Power Module

SLTS202E– MAY 2003 – REVISED NOVENBER 2007

PTH12000W/L — 12-V Input

Characteristics

Symbols

Conditions

Min

Typ

Max

Units

Operating Temperature Range

—

+85

°C

Solder Reflow Temperature(AS)

Surface temperature of module body or pins

°C

Solder Reflow Temperature(AZ)

Surface temperature of module body or pins

°C

WaveSolderTemperature(AH/AD)

Surface temperature of module body or pins(5 seconds)

°C

Storage Temperature

—

–55

—

+125

°C

Mechanical Shock

Per Mil-STD-883D, Method 2002.3

—

500

—

G

1 msec, ½ sine, mounted

Mechanical Vibration

Mil-STD-883D, Method 2007.2

—15

—

G

20-2000 Hz

Weight

—

—

2

—

grams

Flammability

—

Meets UL 94V-O

Notes:

(i) For operation below 0 °C the external capacitors must have stable characteristics. Use either a low ESR tantalum, Oscon, or ceramic capacitor.

(ii) During soldering of package version do not elevate peak temperature of the module, pins or internal components above the stated maximum.