Application information

EMIF02-USB01F2

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2

Application information

Figure 8.

Aplac model (resistors, diodes and bumps and ground connections)

Figure 9.

Aplac model parameters

0.15nH

bulk

rsub_1k3

Csub

Csub

bulk

R_33R

cap_33R

C3

rsub_33R

cap_33R

Csub

Csub

E1

0.23nH

C1

A3

R_1k3

Csub

Csub

3.8nH

rsub_1k3

rsub_33R

0.3nH

bulk

R_33R

cap_33R

E3

rsub_33R

cap_33R

Csub

Csub

0.7nH

rsub_33R

D2

bulk

A1, A3, B2, C1, C3, E1, E3

0.15nH

Lgnd_D

Rsub_D

D02_usb

D02_Nw

D02_usb

D2

Lbump

Rbump

Lhole

Rhole

caphole

bulk

Cbump Rsubump

I/O

bulk

100m

D2

R_33R 33.9

cap_33R 1.2pF

R_1k3 1.3k

Cz29pF

Rsub_D 100

Csub0.3pF

Rsub_33R 15

Rsub_1k3 50

lhole10pH

Rhole400m

Caphole0.4pF

Lgnd_D 150pH

Lbump50pH

Rbump50m

Cbump1.5pF

Rsubump150

R_33R 33.9

cap_33R 1.2pF

R_1k3 1.3k

Model D02_usb

BV=16

IBV=1m

CJO=Cz

M=0.3333

RS=2

VJ=0.6

TT=100n

Model D02_Nw

BV=100

IBV=1m

CJO=6.8p

M=0.3333

RS=2

VJ=0.6

TT=100n