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L7220 Datasheet(PDF) 2 Page - STMicroelectronics |
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L7220 Datasheet(HTML) 2 Page - STMicroelectronics |
2 / 4 page Package information L7220 2/4 1 Package information In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect. The category of second Level Interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Figure 1. TQFP64 mechanical data & package dimensions OUTLINE AND MECHANICAL DATA DIM. mm inch MIN. TYP. MAX. MIN. TYP. MAX. A 1.20 0.0472 A1 0.05 0.15 0.002 0.006 A2 0.95 1.00 1.05 0.0374 0.0393 0.0413 b 0.17 0.22 0.27 0.0066 0.0086 0.0086 c 0.09 0.20 0.0035 0.0078 D 11.80 12.00 12.20 0.464 0.472 0.480 D1 9.80 10.00 10.20 0.386 0.394 0.401 D2 2.00 0.787 D3 7.50 0.295 E 11.80 12.00 12.20 0.464 0.472 0.480 E1 9.80 10.00 10.20 0.386 0.394 0.401 E2 2.00 0.787 E3 7.50 0.295 e 0.50 0.0197 L 0.45 0.60 0.75 0.0177 0.0236 0.0295 L1 1.00 0.0393 k 0˚3.5˚7˚ 0˚3.5˚7˚ ccc 0.080 0.0031 TQFP64 (10x10x1.0mm) Exposed Pad Down 7278840 B |
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