L5961_08 datasheet(4/7 Pages) STMICROELECTRONICS | MOST power management device (PMD)

Part No.	L5961

Description	MOST power management device (PMD)

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Manufacturer	STMICROELECTRONICS [STMicroelectronics]

Direct Link	http://www.st.com

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4 / 7 page

Package information

L5961

4/7

3

Package information

In order to meet environmental requirements, ST (also) offers these devices in ECOPACK®

packages. ECOPACK® packages are lead-free. The category of second Level Interconnect

is marked on the package and on the inner box label, in compliance with JEDEC Standard

JESD97. The maximum ratings related to soldering conditions are also marked on the inner

box label.

ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.

Figure 2.

PowerSSO-36 mechanical data and package dimensions

OUTLINE AND

MECHANICAL DATA

DIM.

mm

inch

MIN.

TYP.

MAX.

MIN.

TYP.

MAX.

A

2.15

2.47

0.084

0.097

A2

2.15

2.40

0.084

0.094

a1

0

0.075

0

0.003

b

0.18

0.36

0.007

0.014

c

0.23

0.32

0.009

0.012

D (1)

10.10

10.50

0.398

0.413

E (1)

7.4

7.6

0.291

0.299

e

0.5

0.019

e3

8.5

0.335

F

2.3

0.090

G

0.10

0.004

G1

0.06

0.002

H

10.10

10.50

0.398

0.413

h

0.40

0.016

k5˚

5˚

L

0.55

0.90

0.022

0.035

M

4.3

0.169

N

10˚

O

1.2

0.047

Q

0.8

0.031

S

2.9

0.114

T3.65

0.144

U

1.0

0.039

X

4.1

4.7

0.161

0.185

Y

6.5

7.3

0.256

0.287

(1) "D” and “E" do not include mold flash or protrusions Mold flash

or protrusions shall not exceed 0.15 mm per side(0.006”)

PowerSSO-36

7587131 A

(exposed pad)

G

LEAD COPLANARITY

BOTTOM VIEW

D

e3

0.1

A

M

B

b

e

A

Y

T

L

hx45

U

O

B

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