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M58MR032C Datasheet(PDF) 5 Page - STMicroelectronics

Part No. M58MR032C
Description  32 Mbit 2Mb x16, Mux I/O, Dual Bank, Burst 1.8V Supply Flash Memory
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

M58MR032C Datasheet(HTML) 5 Page - STMicroelectronics

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M58MR032C, M58MR032D
See Figure 1 and Table 1.
Address Inputs or Data Input/Output (ADQ0-
ADQ15). When Chip Enable E is at VIL and Out-
put Enable G is at VIH the multiplexed address/
data bus is used to input addresses for the memo-
ry array, data to be programmed in the memory ar-
ray or commands to be written to the C.I. The
address inputs for the memory array are latched
on the rising edge of Latch Enable L. The address
latch is transparent when L is at VIL. In synchro-
nous operations the address is also latched on the
first rising/falling edge of K (depending on clock
configuration) when L is low. Both input data and
commands are latched on the rising edge of Write
Enable W. When Chip Enable E and Output En-
able G are at VIL the address/data bus outputs
data from the Memory Array, the Electronic Signa-
ture Manufacturer or Device codes, the Block Pro-
tection status the Read Configuration Register
status, the protection register or the Status Regis-
ter. The address/data bus is high impedance when
the chip is deselected, Output Enable G is at VIH,
or RP is at VIL.
Address Inputs (A16-A20). The five MSB ad-
dresses of the memory array are latched on the
rising edge of Latch Enable L. In synchronous op-
eration these inputs are also latched on the first
rising/falling edge of K (depending on clock config-
uration) when L is low.
Chip Enable (E). The Chip Enable input acti-
vates the memory control logic, input buffers, de-
coders and sense amplifiers. E at VIH deselects
the memory and reduces the power consumption
to the standby level. E can also be used to control
writing to the command register and to the memo-
ry array, while W remains at VIL.
Output Enable (G). The Output Enable gates the
outputs through the data buffers during a read op-
eration. When G is at VIH the outputs are High im-
Write Enable (W). This input controls writing to
the Command Register and Data latches. Data are
latched on the rising edge of W.
Write Protect (WP). This input gives an addition-
al hardware protection level against program or
erase when pulled at VIL, as described in the Block
Lock instruction description.
Reset/Power-down Input (RP). The
provides hardware reset of the memory, and/or
Power-down functions, depending on the Read
Configuration Register status. Reset/Power-down
of the memory is achieved by pulling RP to VIL for
at least tPLPH. When the reset pulse is given, the
memory will recover from Power-down (when en-
abled) in a minimum of tPHEL, tPHLL or tPHWL (see
Table 31 and Figure 15) after the rising edge of
RP. Exit from Reset/Power-down changes the
contents of the Read Configuration Register bits
14 and 15, setting the memory in asynchronous
page mode read and power save function dis-
abled. All blocks are protected and unlocked after
a Reset/Power-down.
Latch Enable (L). L latches the address bits
ADQ0-ADQ15 and A16-A20 on its rising edge.
The address latch is transparent when L is at VIL
and it is inhibited when L is at VIH.
Clock (K). The clock input synchronizes the
memory to the micro controller during burst mode
read operation; the address is latched on a K edge
(rising or falling, according to the configuration set-
tings) when L is at VIL. K is don’t care during asyn-
chronous page mode read and in write operations.
Wait (WAIT). WAIT is an output signal used dur-
ing burst mode read, indicating whether the data
on the output bus are valid or a wait state must be
inserted. This output is high impedance when E or
G are high or RP is at VIL, and can be configured
to be active during the wait cycle or one clock cy-
cle in advance.
Bus Invert (BINV). BINV is an input/output signal
used to reduce the amount of power needed to
switch the external address/data bus. The power
saving is achieved by inverting the data output on
ADQ0-ADQ15 every time this gives an advantage
in terms of number of toggling bits. In burst mode
read, each new data output from the memory is
compared with the previous data. If the number of
transitions required on the data bus is in excess of
8, the data is inverted and the BINV signal will be
driven by the memory at VOH to inform the receiv-
ing system that data must be inverted before any
further processing. By doing so, the actual transi-
tions on the data bus will be less than 8.
In a similar way, when a command is given, BINV
may be driven by the system at VIH to inform the
memory that the data input must be inverted.
Like the other input/output pins, BINV is high im-
pedance when the chip is deselected, output en-
able G is at VIH or RP is at VIL; when used as an
input, BINV must follow the same set-up and hold
timings of the data inputs.
VDD and VDDQ Supply Voltage (1.7V to 2.0V).
VDD is the main power supply for all operations
(Read, Program and Erase). VDDQ is the supply
voltage for Input and Output.

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