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HSDL-1100 Datasheet(PDF) 8 Page - Agilent(Hewlett-Packard)

Part # HSDL-1100
Description  Infrared Transceiver
Download  12 Pages
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Manufacturer  HP [Agilent(Hewlett-Packard)]
Direct Link  http://www.home.agilent.com
Logo HP - Agilent(Hewlett-Packard)

HSDL-1100 Datasheet(HTML) 8 Page - Agilent(Hewlett-Packard)

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8
Recommended Operating Conditions
Parameter
Symbol
Min.
Max.
Units
Conditions
Notes
Operating Temperature
TA
070
°C
Case to Ambient Thermal
Resistance
≤ 50°C/W
9
Supply Voltage
VCC
4.75
5.25
V
Logic High Transmitter
VIH
4.25
5.25
V
8
Input Voltage (TXD)
Logic Low Transmitter
VIL
0.0
0.3
V
8
Input Voltage (TXD)
Logic High Receiver Input
EIIH
0.0036
500
mW/cm2 For in-band signals
≤ 116 Kb/s
7
Irradiance
0.0090
500
mW/cm2 For in-band signals
≤ 576 Kb/s
Logic Low Receiver Input
EIIL
0.3
µW/cm2 For in-band signals
7
Irradiance
LED (Logic High)
ILEDA
400
660
mA
9
Current Pulse Amplitude
Receiver Setup Time
1.0
ms
For full sensitivity after
transmitting
Receiver Signal Rate RXD-A
2.4
116
Kb/s
Receiver Signal Rate RXD-B
0.576
4
Mb/s
Ambient Light
See IrDA Serial Infrared Physical
Layer Link Specification,
Appendix A for ambient levels.
Notes:
7. An in-band optical signal is a pulse/sequence where the peak wavelength,
λp, is defined as 850 nm ≤λp ≤ 900 nm, and the pulse
characteristics are compliant with the IrDA Serial Infrared Physical Layer Link Specification.
8. With RI, CX2 Input network and where tr (VI) and tf (VI) ≤ 5 ns. See Application Circuit (Table 1) for component values. The driver
gate for this input should be able to source and sink
± 6 mA (DC) and ± 50 mA (pk). TXD refers to the node on the driver gate side of
R1, CX2 on application circuit.
9. See the thermal derating curves on pages 8 and 9 for maximum operating conditions in order to maintain T junction <125
°C.
Infrared Reflow Profile
All HSDL-1100 IR transceivers are classified as IEC 825-1 Accessible Emission Limit (AEL) Class 1 based upon the
current proposed draft scheduled to go into effect on January 1, 1997. AEL Class 1 LED devices are considered eye safe.
See Hewlett-Packard Application Note 1094 for more information.
t2 = 11.5 ± .5 MINS. (SOLDER JOINT)
0
TIME (t)
250
200
150
100
50
0
300
2
4
6
8
10
12
14
t1 = 8 ± 1 MINS. (SOLDER JOINT)
T (MAX.) = 250 °C OR 235 °C (+5-0) °C
ANY PART OF COMPONENT BODY
3.5 ± .5 MINS.
(SOLDER JOINT)
T > 120 °C FOR t
GREATER THAN 2.5 MINS.
(SOLDER JOINT)
dT/dt < 3 °C/SEC.
185 °C


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