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HSDL-1100 Datasheet(PDF) 8 Page - Agilent(Hewlett-Packard) |
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HSDL-1100 Datasheet(HTML) 8 Page - Agilent(Hewlett-Packard) |
8 / 12 page 8 Recommended Operating Conditions Parameter Symbol Min. Max. Units Conditions Notes Operating Temperature TA 070 °C Case to Ambient Thermal Resistance ≤ 50°C/W 9 Supply Voltage VCC 4.75 5.25 V Logic High Transmitter VIH 4.25 5.25 V 8 Input Voltage (TXD) Logic Low Transmitter VIL 0.0 0.3 V 8 Input Voltage (TXD) Logic High Receiver Input EIIH 0.0036 500 mW/cm2 For in-band signals ≤ 116 Kb/s 7 Irradiance 0.0090 500 mW/cm2 For in-band signals ≤ 576 Kb/s Logic Low Receiver Input EIIL 0.3 µW/cm2 For in-band signals 7 Irradiance LED (Logic High) ILEDA 400 660 mA 9 Current Pulse Amplitude Receiver Setup Time 1.0 ms For full sensitivity after transmitting Receiver Signal Rate RXD-A 2.4 116 Kb/s Receiver Signal Rate RXD-B 0.576 4 Mb/s Ambient Light See IrDA Serial Infrared Physical Layer Link Specification, Appendix A for ambient levels. Notes: 7. An in-band optical signal is a pulse/sequence where the peak wavelength, λp, is defined as 850 nm ≤λp ≤ 900 nm, and the pulse characteristics are compliant with the IrDA Serial Infrared Physical Layer Link Specification. 8. With RI, CX2 Input network and where tr (VI) and tf (VI) ≤ 5 ns. See Application Circuit (Table 1) for component values. The driver gate for this input should be able to source and sink ± 6 mA (DC) and ± 50 mA (pk). TXD refers to the node on the driver gate side of R1, CX2 on application circuit. 9. See the thermal derating curves on pages 8 and 9 for maximum operating conditions in order to maintain T junction <125 °C. Infrared Reflow Profile All HSDL-1100 IR transceivers are classified as IEC 825-1 Accessible Emission Limit (AEL) Class 1 based upon the current proposed draft scheduled to go into effect on January 1, 1997. AEL Class 1 LED devices are considered eye safe. See Hewlett-Packard Application Note 1094 for more information. t2 = 11.5 ± .5 MINS. (SOLDER JOINT) 0 TIME (t) 250 200 150 100 50 0 300 2 4 6 8 10 12 14 t1 = 8 ± 1 MINS. (SOLDER JOINT) T (MAX.) = 250 °C OR 235 °C (+5-0) °C ANY PART OF COMPONENT BODY 3.5 ± .5 MINS. (SOLDER JOINT) T > 120 °C FOR t GREATER THAN 2.5 MINS. (SOLDER JOINT) dT/dt < 3 °C/SEC. 185 °C |
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