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SMJ320C40HFHM40 Datasheet(PDF) 1 Page - Texas Instruments |
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SMJ320C40HFHM40 Datasheet(HTML) 1 Page - Texas Instruments |
1 / 64 page SMJ320C40, TMP320C40 DIGITAL SIGNAL PROCESSORS SGUS017H − OCTOBER 1993 − REVISED OCTOBER 2001 1 POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251−1443 D SMJ: QML Processing to MIL−PRF−38535 D SM: Standard Processing D TMP: Commercial Level Processing TAB D Operating Temperature Ranges: − Military (M) − 55 °C to 125°C − Special (S) − 55 °C to 100°C − Commercial (C) − 25 °C to 85°C − Commercial (L) 0 °C to 70°C D Highest Performance Floating-Point Digital Signal Processor (DSP) − C40-60: 33-ns Instruction Cycle Time: 60 MFLOPS, 30 MIPS, 330 MOPS, 384 MBps − C40-50: 40-ns Instruction Cycle Time: 50 MFLOPS, 25 MIPS, 275 MOPS, 320 MBps − C40-40: 50-ns Instruction Cycle Time: 40 MFLOPS, 20 MIPS, 220 MOPS, 256 MBps D Six Communications Ports D 6-Channel Direct Memory Access (DMA) Coprocessor D Single-Cycle Conversion to and From IEEE-745 Floating-Point Format D Single Cycle 1/x, 1/ D Source-Code Compatible With SMJ320C30 D Validated Ada Compiler D Single-Cycle 40-Bit Floating-Point, 32-Bit Integer Multipliers D 12 40-Bit Registers, 8 Auxiliary Registers, 14 Control Registers, and 2 Timers D IEEE Standard 1149.1† Test-Access Port (JTAG) D Two Identical External Data and Address Buses Supporting Shared Memory Systems and High Data-Rate, Single-Cycle Transfers: − High Port-Data Rate of 100 MBytes/s (Each Bus) − 16G-Byte Continuous Program/Data/Peripheral Address Space − Memory-Access Request for Fast, Intelligent Bus Arbitration − Separate Address-, Data-, and Control-Enable Pins − Four Sets of Memory-Control Signals Support Different Speed Memories in Hardware D Packaging: − 325-Pin Ceramic Grid Array (GF Suffix) − 352-Lead Ceramic Quad Flatpack (HFH Suffix) − 324-Pad JEDEC-Standard TAB Frame D Fabricated Using Enhanced Performance Implanted CMOS (EPIC ) Technology by Texas Instruments (TI ) D Separate Internal Program, Data, and DMA Coprocessor Buses for Support of Massive Concurrent Input/Output (I/O) of Program and Data Throughput, Maximizing Sustained Central Processing Unit (CPU) Performance D On-Chip Program Cache and Dual-Access/Single-Cycle RAM for Increased Memory-Access Performance − 512-Byte Instruction Cache − 8K Bytes of Single-Cycle Dual-Access Program or Data RAM − ROM-Based Bootloader Supports Program Bootup Using 8-, 16-, or 32-Bit Memories Over Any One of the Communications Ports Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright 2001, Texas Instruments Incorporated x † IEEE Standard 1149.1- 1990, IEEE Standard Test-Access Port and Boundary-Scan Architecture. EPIC and TI are trademarks of Texas Instruments Incorporated. On products compliant to MILPRF38535, all parameters are tested unless otherwise noted. On all other products, production processing does not necessarily include testing of all parameters. |
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