PACKAGING INFORMATION

Orderable Device

Status

(1)

Package

Type

Package

Drawing

Pins Package

Qty

Eco Plan

(2)

Lead/Ball Finish

MSL Peak Temp

(3)

SN74LVC1G06DBVR

ACTIVE

SOT-23

DBV

5

3000 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

SN74LVC1G06DBVRE4

ACTIVE

SOT-23

DBV

5

3000 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

SN74LVC1G06DBVRG4

ACTIVE

SOT-23

DBV

5

3000 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

SN74LVC1G06DBVT

ACTIVE

SOT-23

DBV

5

250

Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

SN74LVC1G06DBVTE4

ACTIVE

SOT-23

DBV

5

250

Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

SN74LVC1G06DBVTG4

ACTIVE

SOT-23

DBV

5

250

Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

SN74LVC1G06DCKR

ACTIVE

SC70

DCK

5

3000 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

SN74LVC1G06DCKRE4

ACTIVE

SC70

DCK

5

3000 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

SN74LVC1G06DCKRG4

ACTIVE

SC70

DCK

5

3000 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

SN74LVC1G06DCKT

ACTIVE

SC70

DCK

5

250

Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

SN74LVC1G06DCKTE4

ACTIVE

SC70

DCK

5

250

Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

SN74LVC1G06DCKTG4

ACTIVE

SC70

DCK

5

250

Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

SN74LVC1G06DRLR

ACTIVE

SOT

DRL

5

4000 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

SN74LVC1G06DRLRG4

ACTIVE

SOT

DRL

5

4000 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

SN74LVC1G06YZPR

ACTIVE

WCSP

YZP

5

3000 Green (RoHS &

no Sb/Br)

SNAGCU

Level-1-260C-UNLIM

SN74LVC1G06YZTR

ACTIVE

DSBGA

YZT

4

3000 Green (RoHS &

no Sb/Br)

SNAGCU

Level-1-260C-UNLIM

SN74LVC1G06YZVR

ACTIVE

DSBGA

YZV

4

3000 Green (RoHS &

no Sb/Br)

SNAGCU

Level-1-260C-UNLIM

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in

a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

http://www.ti.com/productcontent for the latest availability information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements

for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered

at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and

package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS

compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame

PACKAGE OPTION ADDENDUM

www.ti.com

22-Oct-2007

Addendum-Page 1