2002 Feb 27
5
BCcomponents
Preliminary specification
Aluminum electrolytic capacitors SMD (Chip)
Long life base plate, very low impedance
150 CLZ
MOUNTING
The capacitors are designed for
automatic placement on to
printed-circuit boards.
Optimum dimensions of soldering
pads depend amongst others on
soldering method, mounting accuracy,
print lay-out and/or adjacent
components.
For recommended soldering pad
dimensions, refer to Fig.3 and Table 3
Soldering
Soldering conditions are defined by
the curve, temperature versus time,
where the temperature is that
measured on the soldering pad during
processing.
For maximum conditions refer to Fig.4.
Any temperature versus time curve
which does not exceed the specified
maximum curves may be applied.
AS A GENERAL PRINCIPLE,
TEMPERATURE AND DURATION
SHALL BE THE MINIMUM
NECESSARY REQUIRED TO ENSURE
GOOD SOLDERING
CONNECTIONS. HOWEVER, THE
SPECIFIED MAXIMUM CURVES
SHOULD NEVER BE EXCEEDED.
c
a
a
b
CCA857
Fig.3 Recommended soldering pad dimensions.
For dimensions see Table 3.
Table 3
Recommended soldering pad dimensions; see Fig.3
CASE CODE
a
(mm)
b
(mm)
c
(mm)
0810
3.5
2.5
3.0
1010
4.3
2.5
4.0
1014
4.3
2.5
4.0
Fig.4
Maximum temperature load during infrared reflow soldering
measured on the soldering pad.
250
280
80
0
50
200
MBA533
180
150
100
200
220
240
260
160
140
120
100
T
PAD
( C)
o
t (s)
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