PALCE22V10
Document #: 38-03027 Rev. **
Page 10 of 13
MILITARY SPECIFICATIONS
Group A Subgroup Testing
Ordering Information
ICC
(mA)
tPD
(ns)
tS
(ns)
tCO
(ns)
Ordering Code
Package
Name
Package Type
Operating
Range
130
5
3
4
PALCE22V10-5PC
P13
24-Lead (300 MIL) Molded DIP
Commercial
PALCE22V10-5JC
J64
28-Lead Plastic Leaded Chip Carrier
130
7.5
5
5
PALCE22V10-7JC
J64
28-Lead Plastic Leaded Chip Carrier
Commercial
PALCE22V10-7PC
P13
24-Lead (300-Mil) Molded DIP
90
10
6
7
PALCE22V10-10JC
J64
28-Lead Plastic Leaded Chip Carrier
Commercial
PALCE22V10-10PC
P13
24-Lead (300-Mil) Molded DIP
150
10
6
7
PALCE22V10-10JI
J64
28-Lead Plastic Leaded Chip Carrier
Industrial
PALCE22V10-10PI
P13
24-Lead (300-Mil) Molded DIP
150
10
6
7
PALCE22V10-10DMB
D14
24-Lead (300-Mil) CerDIP
Military
PALCE22V10-10KMB
K73
24-Lead Rectangular Cerpack
PALCE22V10-10LMB
L64
28-Square Leadless Chip Carrier
90
15
7.5
10
PALCE22V10-15JC
J64
28-Lead Plastic Leaded Chip Carrier
Commercial
PALCE22V10-15PC
P13
24-Lead (300-Mil) Molded DIP
120
15
7.5
10
PALCE22V10-15JI
J64
28-Lead Plastic Leaded Chip Carrier
Industrial
PALCE22V10-15PI
P13
24-Lead (300-Mil) Molded DIP
120
15
7.5
10
PALCE22V10-15DMB
D14
24-Lead (300-Mil) CerDIP
Military
PALCE22V10-15KMB
K73
24-Lead Rectangular Cerpack
PALCE22V10-15LMB
L64
28-Square Leadless Chip Carrier
90
25
15
15
PALCE22V10-25JC
J64
28-Lead Plastic Leaded Chip Carrier
Commercial
PALCE22V10-25PC
P13
24-Lead (300-Mil) Molded DIP
120
25
15
15
PALCE22V10-25JI
J64
28-Lead Plastic Leaded Chip Carrier
Industrial
PALCE22V10-25PI
P13
24-Lead (300-Mil) Molded DIP
120
25
15
15
PALCE22V10-25DMB
D14
24-Lead (300-Mil) CerDIP
Military
PALCE22V10-25KMB
K73
24-Lead Rectangular Cerpack
PALCE22V10-25LMB
L64
28-Square Leadless Chip Carrier
DC Characteristics
Parameter
Subgroups
VOH
1, 2, 3
VOL
1, 2, 3
VIH
1, 2, 3
VIL
1, 2, 3
IIX
1, 2, 3
IOZ
1, 2, 3
ICC
1, 2, 3
Switching Characteristics
Parameter
Subgroups
tPD
9, 10, 11
tCO
9, 10, 11
tS
9, 10, 11
tH
9, 10, 11