LX7206

Microsemi

Integrated Products Division

11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570

Page 3

Copyright

© 2004

Rev. 1.0, 2004-10-05

Integrated EMI Filter & ESD Protection for

Earpiece Speaker & Microphone Ports

TM

®

RECOMM END E D PCB PARA METERS

Parameter

Value

Cu pad size

0.275 +0.0/-0.025 mm

Pad Pitch

0.5mm

Pad Definition

Non-Solder Mask Defined

Solder Mask Opening

0.325 ± 0.025 mm

Solder Stencil

0.25 x 0.25 mm square,

0.125 mm thick, laser cut, electro-polished

Pad Protective Finish

OSP (Organic Surface Preservative)

Solder Mask Opening

0.325 mm dia.

Non-Solder Mask Defined Cu

Pad (OSP finish)

0.275 mm dia.

Figure 1 – Recommended Non-Solder Mask Defined Pad

Time (s)

~ 1min

~2 min

~ 1min

Cooling Zone

Preheat Zone

Flux Activation

Zone

Solder Reflow

Zone

Figure 2 – Solder Reflow Profile. Maximum temperature is 240°C and maximum time above liquidous (183°C) is 60

seconds.