CY62146E MoBL®
Document Number: 001-07970 Rev. *D
Page 3 of 11
Maximum Ratings
Exceeding maximum ratings may impair the useful life of the
device. These user guidelines are not tested.
Storage Temperature .................................. –65°C to +150°C
Ambient Temperature with
Power Applied ............................................ –55°C to +125°C
Supply Voltage to Ground Potential..................–0.5V to 6.0V
DC Voltage Applied to Outputs
in High-Z State [3, 4] ..........................................–0.5V to 6.0V
DC Input Voltage [3, 4] .......................................–0.5V to 6.0V
Output Current into Outputs (LOW)............................. 20 mA
Static Discharge Voltage............................................ >2001V
(MIL-STD-883, Method 3015)
Latch up Current...................................................... >200 mA
Operating Range
Device
Range
Ambient
Temperature
VCC
[5]
CY62146ELL
Ind’l/Auto-A
–40°C to +85°C
4.5V–5.5V
Electrical Characteristics
Over the Operating Range
Parameter
Description
Test Conditions
45 ns (Ind’l/Auto-A)
Unit
Min
Typ [2]
Max
VOH
Output HIGH Voltage
IOH = –1.0 mA
2.4
V
VOL
Output LOW Voltage
IOL = 2.1 mA
0.4
V
VIH
Input HIGH Voltage
4.5 < VCC < 5.5
2.2
VCC + 0.5
V
VIL
Input LOW Voltage
4.5 < VCC < 5.5
–0.5
0.8
V
IIX
Input Leakage Current
GND < VI < VCC
–1
+1
μA
IOZ
Output Leakage Current GND < VO < VCC, Output Disabled
–1
+1
μA
ICC
VCC Operating Supply
Current
f = fmax = 1/tRC
VCC = VCCmax
IOUT = 0 mA, CMOS levels
15
20
mA
f = 1 MHz
2
2.5
ISB2
[6]
Automatic CE Power
down Current — CMOS
Inputs
CE > VCC – 0.2V, VIN > VCC – 0.2V or VIN < 0.2V,
f = 0, VCC = VCC(max)
17
μA
Capacitance
Tested initially and after any design or process changes that may affect these parameters.
Parameter
Description
Test Conditions
Max
Unit
CIN
Input Capacitance
TA = 25°C, f = 1 MHz,
VCC = VCC(typ)
10
pF
COUT
Output Capacitance
10
pF
Thermal Resistance
Tested initially and after any design or process changes that may affect these parameters.
Parameter
Description
Test Conditions
TSOP II
Unit
Θ
JA
Thermal Resistance
(Junction to Ambient)
Still Air, soldered on a 3 × 4.5 inch, two layer
printed circuit board
77
°C/W
Θ
JC
Thermal Resistance
(Junction to Case)
13
°C/W
Notes
3. VIL(min) = –2.0V for pulse durations less than 20 ns for I < 30 mA.
4. VIH(max) = VCC + 0.75V for pulse durations less than 20 ns.
5. Full Device AC operation assumes a minimum of 100
μs ramp time from 0 to V
CC (min) and 200 μs wait time after VCC stabilization.
6. Only chip enable (CE) and byte enables (BHE and BLE) is tied to CMOS levels to meet the ISB2 / ICCDR spec. Other inputs are left floating.
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