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CY62146CV18 MoBL2™
Document #: 38-05010 Rev. *C
Page 3 of 12
Electrical Characteristics Over the Operating Range
CY62146CV18
MoBL2™-55
CY62146CV18
MoBL2™-70
Param-
eter
Description
Test Conditions
Min.
Typ.[4]
Max
Min.
Typ.[4]
Max.
Unit
VOH
Output HIGH Voltage IOH = –0.1 mA
VCC = 1.65V
1.4
1.4
V
VOL
Output LOW Voltage IOL = 0.1 mA
VCC = 1.65V
0.2
0.2
V
VIH
Input HIGH Voltage
1.4
VCC +
0.2V
1.4
VCC +
0.2V
V
VIL
Input LOW Voltage
−0.2
0.4
−0.2
0.4
V
IIX
Input Load Current
GND < VI < VCC
−1+1
−1+1
µA
IOZ
Output Leakage
Current
GND < VO < VCC, Output
Disabled
−1+1
−1+1
µA
ICC
VCC Operating Supply
Current
f = fMAX = 1/tRC
VCC = 1.95V
IOUT = 0 mA
CMOS levels
2.5
7
2
6
mA
f = 1 MHz
0.5
3
0.5
3
mA
ISB1
Automatic CE
Power-down
Current— CMOS
Inputs
CE > VCC − 0.2V,
VIN > VCC − 0.2V, VIN < 0.2V
f = fMAX (Address and Data Only),
f = 0 (OE, WE, BHE, and BLE)
110
1
10
µA
ISB2
Automatic CE
Power-down
Current— CMOS
Inputs
CE > VCC − 0.2V
VIN > VCC − 0.2V or VIN < 0.2V,
f = 0, VCC = 1.95V
Capacitance[5]
Parameter
Description
Test Conditions
Max.
Unit
CIN
Input Capacitance
TA = 25°C, f = 1 MHz,
VCC= VCC(typ.)
8
pF
COUT
Output Capacitance
10
pF
Thermal Resistance
Description
Test Conditions
Symbol
BGA
Unit
Thermal Resistance
(Junction to Ambient)[5]
Still Air, soldered on a 4.25 x 1.125 inch, 4-layer
printed circuit board
Θ
JA
55
°C/W
Thermal Resistance
(Junction to Case)[5]
Θ
JC
16
°C/W
Note:
5.
Tested initially and after any design or process changes that may affect these parameters.