CY2302
Document #: 38-07154 Rev. *A
Page 6 of 7
© Cypress Semiconductor Corporation, 2005. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use
of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be
used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its
products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress
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Ordering Information
Ordering Code
Package Type
Temperature Grade
CY2302SC-1
8 pin SOIC
Commercial
CY2302SC-1T
8 pin SOIC - Tape and Reel
Commercial
CY2302SI-1
8 pin SOIC
Industrial
CY2302SI-1T
8 pin SOIC - Tape and Reel
Industrial
Lead-free
CY2302SXC-1
8 pin SOIC
Commercial
CY2302SXC-1T
8 pin SOIC - Tape and Reel
Commercial
CY2302SXI-1
8 pin SOIC
Industrial
CY2302SXI-1T
8 pin SOIC - Tape and Reel
Industrial
Package Diagram
SEATING PLANE
PIN1ID
0.230[5.842]
0.244[6.197]
0.157[3.987]
0.150[3.810]
0.189[4.800]
0.196[4.978]
0.050[1.270]
BSC
0.061[1.549]
0.068[1.727]
0.004[0.102]
0.0098[0.249]
0.0138[0.350]
0.0192[0.487]
0.016[0.406]
0.035[0.889]
0.0075[0.190]
0.0098[0.249]
1. DIMENSIONS IN INCHES[MM] MIN.
MAX.
0°~8°
0.016[0.406]
0.010[0.254]
X 45°
2. PIN 1 ID IS OPTIONAL,
ROUND ON SINGLE LEADFRAME
RECTANGULAR ON MATRIX LEADFRAME
0.004[0.102]
8 Lead (150 Mil) SOIC - S08
1
4
58
3. REFERENCE JEDEC MS-012
PART #
S08.15 STANDARD PKG.
SZ08.15 LEAD FREE PKG.
4. PACKAGE WEIGHT 0.07gms
8-lead (150-Mil) SOIC S8
51-85066-*C
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