7 / 9 page
CY23S09
CY23S05
Document #: 38-07296 Rev. *C
Page 7 of 9
Package Diagrams
SEATING PLANE
PIN1ID
0.230[5.842]
0.244[6.197]
0.157[3.987]
0.150[3.810]
0.189[4.800]
0.196[4.978]
0.050[1.270]
BSC
0.061[1.549]
0.068[1.727]
0.004[0.102]
0.0098[0.249]
0.0138[0.350]
0.0192[0.487]
0.016[0.406]
0.035[0.889]
0.0075[0.190]
0.0098[0.249]
1. DIMENSIONS IN INCHES[MM] MIN.
MAX.
0°~8°
0.016[0.406]
0.010[0.254]
X 45°
2. PIN 1 ID IS OPTIONAL,
ROUND ON SINGLE LEADFRAME
RECTANGULAR ON MATRIX LEADFRAME
0.004[0.102]
8 Lead (150 Mil) SOIC - S08
1
4
58
3. REFERENCE JEDEC MS-012
PART #
S08.15 STANDARD PKG.
SZ08.15 LEAD FREE PKG.
4. PACKAGE WEIGHT 0.07gms
51-85066-*C
8-lead (150-Mil) SOIC S8
PIN 1 ID
0°~8°
16 Lead (150 Mil) SOIC
1
8
916
SEATING PLANE
0.230[5.842]
0.244[6.197]
0.157[3.987]
0.150[3.810]
0.386[9.804]
0.393[9.982]
0.050[1.270]
BSC
0.061[1.549]
0.068[1.727]
0.004[0.102]
0.0098[0.249]
0.0138[0.350]
0.0192[0.487]
0.016[0.406]
0.035[0.889]
0.0075[0.190]
0.0098[0.249]
DIMENSIONS IN INCHES[MM] MIN.
MAX.
0.016[0.406]
0.010[0.254]
X 45°
0.004[0.102]
REFERENCE JEDEC MS-012
PART #
S16.15 STANDARD PKG.
SZ16.15 LEAD FREE PKG.
PACKAGE WEIGHT 0.15gms
16-Lead (150-Mil) SOIC S16.15
51-85068-*B