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PRELIMINARY
CY7C185D
Document #: 38-05466 Rev. *C
Page 8 of 10
Package Diagrams
DIMENSIONS IN INCHES [MM] MIN.
MAX.
SEATING PLANE
0.260[6.60]
0.295[7.49]
0.090[2.28]
0.110[2.79]
0.055[1.39]
0.065[1.65]
0.015[0.38]
0.020[0.50]
0.015[0.38]
0.060[1.52]
0.120[3.05]
0.140[3.55]
0.009[0.23]
0.012[0.30]
0.310[7.87]
0.385[9.78]
0.290[7.36]
0.325[8.25]
0.030[0.76]
0.080[2.03]
0.115[2.92]
0.160[4.06]
0.140[3.55]
0.190[4.82]
1.345[34.16]
1.385[35.18]
3° MIN.
1
14
15
28
REFERENCE JEDEC MO-095
LEAD END OPTION
SEE LEAD END OPTION
SEE LEAD END OPTION
(LEAD #1, 14, 15 & 28)
PACKAGE WEIGHT: 2.15 gms
28-Lead (300-Mil) PDIP P21
51-85014-*D
DIMENSIONS IN INCHES[MM]
MIN.
MAX.
PIN1ID
0.291[7.39]
0.300[7.62]
0.394[10.01]
0.419[10.64]
0.050[1.27]
TYP.
0.092[2.33]
0.105[2.67]
0.004[0.10]
0.0118[0.30]
SEATING PLANE
0.0091[0.23]
0.0125[3.17]
0.015[0.38]
0.050[1.27]
0.013[0.33]
0.019[0.48]
0.026[0.66]
0.032[0.81]
0.697[17.70]
0.713[18.11]
0.004[0.10]
1
14
15
28
*
*
*
REFERENCE JEDEC MO-119
PART #
S28.3 STANDARD PKG.
SZ28.3 LEAD FREE PKG.
PACKAGE WEIGHT 0.85gms
51-85026-*C
28-Lead (300-Mil) Molded SOIC S21