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CY7C182 Datasheet(PDF) 1 Page - Cypress Semiconductor

Part # CY7C182
Description  8Kx9 Static RAM
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Manufacturer  CYPRESS [Cypress Semiconductor]
Direct Link  http://www.cypress.com
Logo CYPRESS - Cypress Semiconductor

CY7C182 Datasheet(HTML) 1 Page - Cypress Semiconductor

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8Kx9 Static RAM
CY7C182
Cypress Semiconductor Corporation
3901 North First Street
San Jose
CA 95134
408-943-2600
Document #: 38-05031 Rev. **
Revised August 24, 2001
182
Features
• High speed
—tAA = 25 ns
• x9 organization is ideal for cache memory applications
• CMOS for optimum speed/power
• Low active power
— 770 mW
• Low standby power
— 195 mW
• TTL-compatible inputs and outputs
• Automatic power-down when deselected
• Easy memory expansion with CE1, CE2, OE options
Functional Description
The CY7C182 is a high-speed CMOS static RAM organized
as 8,192 by 9 bits and it is manufactured using Cypress’s high-
performance CMOS technology. Access times as fast as 25 ns
are available with maximum power consumption of only 770
mW.
The CY7C182, which is oriented toward cache memory appli-
cations, features fully static operation requiring no external
clocks or timing strobes. The automatic power-down feature
reduces the power consumption by more than 70% when the
circuit is deselected. Easy memory expansion is provided by
an active-LOW Chip Enable (CE1), an active HIGH Chip En-
able (CE2), an active-LOW Output Enable (OE), and three-
state drivers.
An active-LOW Write Enable signal (WE) controls the writ-
ing/reading operation of the memory. When CE1 and WE in-
puts are both LOW, data on the nine data input/output pins
(I/O0 through I/O8) is written into the memory location ad-
dressed by the address present on the address pins (A0
through A12). Reading the device is accomplished by selecting
the device and enabling the outputs, (CE1 and OE active LOW
and CE2 active HIGH), while (WE) remains inactive or HIGH.
Under these conditions, the contents of the location addressed
by the information on address pins is present on the nine data
input/output pins.
The input/output pins remain in a high-impedance state unless
the chip is selected, outputs are enabled, and write enable
(WE) is HIGH.
A die coat is used to insure alpha immunity.
Logic Block Diagram
Pin Configuration
C182–1
A1
A2
A3
A4
A5
A6
A7
A8
I/O0
C182–2
1
2
3
4
5
6
7
8
9
10
11
12
13
14
28
27
26
25
24
23
22
21
20
19
18
17
16
15
VCC
WE
CE 2
A 3
A 2
A 1
OE
A 0
CE 1
I/O 8
I/O 7
I/O 6
I/O 5
I/O 4
A4
A5
A6
A7
A8
A9
A 10
A 11
A 12
I/O 0
I/O 1
I/O 2
I/O 3
GND
256 x 32 x 9
ARRAY
INPUT BUFFER
COLUMN
POWER
DOWN
I/O1
I/O2
I/O3
I/O4
I/O5
I/O6
I/O7
CE1
CE2
WE
OE
Top View
DIP/SOJ
I/O8
DECODER
Selection Guide
7C182-25
7C182-35
7C182-45
Maximum Access Time (ns)
25
35
45
Maximum Operating Current (mA)
140
140
140
Maximum Standby Current (mA)
35
35
35


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