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LM3200 Datasheet(PDF) 2 Page - National Semiconductor (TI)

[Old version datasheet] Texas Instruments acquired National semiconductor.
Part No. LM3200
Description  Miniature, Adjustable, Step-Down DC-DC Converter with Bypass Mode for RF Power Amplifiers
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Maker  NSC [National Semiconductor (TI)]
Homepage  http://www.national.com
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LM3200 Datasheet(HTML) 2 Page - National Semiconductor (TI)

 
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Connection Diagrams
20126102
Top View
20126103
Bottom View
10–Bump Thin Micro SMD Package, Large Bump
See NS Package Number TLP10NHA
Order Information
Order Number
Package Marking (Note)
Supplied As
LM3200TL
XYTT SCUB
250 Units, Tape and Reel
LM3200TLX
XYTT SCUB
3000 Units, Tape and Reel
Note: The package marking “XY” designates the date code. “TT” is a NSC internal code for die traceability.
Pin Description
Pin #
Name
Description
A1
V
DD
Analog Supply Input. A 0.1 µF ceramic capacitor is recommended to be placed as close to this
pin as possible. (Figure 1)
B1
V
CON
Voltage Control Analog input. V
CON controls VOUT in PWM mode. Set: VOUT =3xVCON. Do not
leave floating.
C1
FB
Feedback Analog Input. Connect to the output at the output filter capacitor. (Figure 1)
D1
BYP
Bypass. Use this digital input to command operation in Bypass mode. Set BYP low for normal
operation.
D2
EN
Enable Input. Set this digital input high after Vin >2.7V for normal operation. For shutdown, set
low.
D3
PGND
Power Ground
C3
SW
Switching Node connection to the internal PFET switch and NFET synchronous rectifier.
Connect to an inductor with a saturation current rating that exceeds the maximum Switch Peak
Current Limit specification of the LM3200.
B3
PV
IN
Power Supply Voltage Input to the internal PFET switch and Bypass FET. (Figure 1)
A3
BYPOUT
Bypass FET Drain. Connect to the output capacitor. (Figure 1) Do not leave floating.
A2
SGND
Analog and Control Ground
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